3D Printing Conductive Agent Formulation for Stable Resistivity
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Solution Overview
Problem
Current 3D printing techniques using conductive materials often result in parts with low electrical conductivity and high variability in electrical characteristics due to the presence of pretreat agents like salt, making them unsuitable for applications like circuit boards and conductive traces, and require long processing times and high temperatures.
Innovation Solution
A 3D printing method that employs a polymer-conductive agent composite with a minimal amount of pretreat agents, using a system with a supply of polymer build material, a conductive agent, and a non-conductive fusing agent, where the conductive agent is selectively applied and thermally bound to create a conductive continuous body, while the non-conductive fusing agent forms a dense body, achieving stable resistivity and mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive materials are used in 3D printing, then electrical conductivity is achieved, but electrical conductivity stability and high conductivity are compromised due to pretreat agents like salt
Solution Approach 1:
The patent removes salt and other pretreat agents from the 3D printing process entirely. The build material is formulated without these harmful additives, eliminating the source of electrical conductivity variability while maintaining the ability to create conductive parts through thermal binding of conductive particulates.
Solution Approach 2:
The patent changes the chemical composition parameters of the build material by eliminating salt and pretreat agents. This fundamental parameter change transforms the material system from one requiring chemical activation to one that achieves conductivity through physical thermal binding, thereby stabilizing electrical properties.
2Ease of manufacture
If salt pretreat agents are used, then conductive materials can be applied, but electrical characteristic variability increases due to humidity sensitivity
Solution Approach 1:
The patent eliminates the harmful effect of salt hygroscopy by removing salt entirely from the formulation. Instead of trying to manage the humidity-salt interaction, the solution is to eliminate salt, thereby converting a problematic material choice into a stable, humidity-resistant conductive printing system.
3Productivity
If conventional 3D printing processes are used, then parts can be produced, but processing time increases and temperature requirements increase due to high melt temperatures
Solution Approach 1:
The patent changes the thermal parameters of the build material by selecting polymers with lower melt temperatures and optimizing the formulation to enable processing at reduced temperatures. This allows faster heating cycles and shorter processing times while maintaining part quality and conductive properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces 3D printed parts with high conductivity and stability over varying humidity levels, allowing for controlled fusing degrees suitable for diverse applications, reducing processing time and temperature requirements.
Implementation Method 1
heating the polymer build material, the selectively applied conductive agent, and the non-conductive fusing agent to a sintering temperature of from about 80°C. to about 250°C. to: substantially remove at least the co-solvent, and thermally bind: the polymer build material and the at least one conductive particulate
Implementation Method 2
heating the polymer build material, the selectively applied conductive agent, and the non-conductive fusing agent to a sintering temperature of from about 80°C. to about 250°C. to: substantially remove at least the co-solvent
Implementation Method 3
heating the polymer build material, the selectively applied conductive agent, and the non-conductive fusing agent to a sintering temperature of from about 80°C. to about 250°C. to thermally bind: the polymer build material and the at least one non-conductive particulate
Data Source
AI summary
In an example, a composition for three-dimensional (3D) printing includes a polymer build material and a non-conductive fusing agent dispensable onto the polymer build material to form a polymer-fusing agent composite portion when heated to a sintering temperature, a conductive agent dispensable onto on the polymer build material to form a polymer-conductive agent composite portion when heated at least to the sintering temperature, the conductive agent comprising: at least one conductive particulate present in an amount of from about 10% to about 60% of a total weight of the conductive agent; at least one co-solvent present in an amount of from about 10% to about 50% of a total weight of the conductive agent; and an additive present in an amount of from about 0% to about 10% of a total weight of the conductive agent.