Conductive Alignment Protrusions for Thermal Management in 3D Package Modules

Solution Overview

Problem

Conventional 3D packaging in electronic devices faces challenges with thermal management due to misalignment between the die and the PCB, leading to inefficient heat dissipation and potential die instability at high temperatures.

Innovation Solution

Incorporation of conductive alignment protrusions and test pads in the package module, with corresponding bonding pads on the circuit board, allowing for alignment verification through open/short tests to ensure proper contact and heat dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If conventional MPM assembly technology is used to integrate different dice functions, then integration density is improved, but thermal management capability deteriorates due to misalignment between die and PCB

Engineering Contradiction:

Improveintegration densityVSAvoidthermal management capability

Core Design Contradiction:

Quantity of substanceVSTemperature

Solution Approach 1:

Conductive alignment protrusions are formed on the package substrate before die mounting to establish precise alignment features. These protrusions extend beyond the die area and make contact with corresponding bonding pads on the PCB, ensuring proper thermal conduction path alignment is established in advance before the die is mounted, thereby preventing misalignment issues during assembly

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conductive alignment protrusions serve as intermediary elements between the package substrate and the PCB. These protrusions not only provide mechanical alignment but also establish reliable thermal conduction paths by contacting the heat dissipating structure on the PCB, acting as a mediator that ensures both alignment and thermal management functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

2Quantity of substance

If die is mounted on package substrate by flip chip, then mounting density is improved, but alignment precision deteriorates leading to incomplete contact with heat conductive paste

Engineering Contradiction:

Improvemounting densityVSAvoidalignment precision

Core Design Contradiction:

Quantity of substanceVSManufacturing precision

Solution Approach 1:

Alignment protrusions are pre-formed on the package substrate before die mounting. These protrusions extend beyond the die area and serve as mechanical alignment references that guide the die position during flip chip mounting, ensuring that the die and underlying heat conductive paste are properly aligned before the mounting process completes

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conductive alignment protrusions serve dual functions: they provide mechanical alignment references for precise die positioning and simultaneously establish thermal conduction paths. The structure self-aligns the die with the heat dissipating structure on the PCB, eliminating the need for separate alignment procedures and ensuring complete contact with heat conductive paste

Inventive Principle:

Principle #25Self-service

3Loss of energy

If heat dissipation relies only on conduction through heat conductive paste, then thermal conduction efficiency is improved, but reliability deteriorates due to misalignment reducing contact quality

Engineering Contradiction:

Improvethermal conduction efficiencyVSAvoidcontact quality

Core Design Contradiction:

Loss of energyVSReliability

Solution Approach 1:

Conductive alignment protrusions are formed on the package substrate before die mounting to establish precise alignment features. These protrusions extend beyond the die area and make contact with corresponding bonding pads on the PCB, ensuring proper thermal conduction path alignment is established in advance before the die is mounted, thereby preventing misalignment issues during assembly

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The conductive alignment protrusions serve as intermediary elements between the package substrate and the PCB. These protrusions not only provide mechanical alignment but also establish reliable thermal conduction paths by contacting the heat dissipating structure on the PCB, acting as a mediator that ensures both alignment and thermal management functionality

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Ensures accurate alignment and complete contact between the die and heat conductive paths, enhancing thermal management and preventing die instability by verifying alignment and ensuring effective heat dissipation.

Implementation Method 1

heat generated from the die 14 is dissipated by conduction only. Accordingly, heat generated from the die 14 is dissipated by conduction only. Typically, a metal layer 102 is disposed on the PCB 101 corresponding to the die 14 and connected to the die 14 by a heat conductive paste 22.

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS7755083B2Package module with alignment structure and electronic device with the same

Publication Date: 2010.07.13 VIA TECH INC

AI summary

A package module with an alignment structure is provided by this invention. The package module comprises a package substrate having a die region and a die disposed thereon. At least one pair of conductive alignment protrusions is disposed in the die region and is separated from each other by the die. A test pad is disposed on the package substrate opposing the die and electrically connected to the pair of conductive alignment protrusions. An electronic device with an alignment structure and an inspection method after mounting is also disclosed.