Conductive Ball Mounting via Mask and Adhesive Film
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Solution Overview
Problem
Existing methods for mounting conductive balls on substrates, such as solder balls on wiring substrates, face inefficiencies in removing excess balls, leading to low manufacturing efficiency and potential misplacement of balls during the process, especially when using brushes or air to relocate excess balls.
Innovation Solution
A method involving a mask with opening portions and a ball removal film, where excess conductive balls are bonded to an adhesive or electrostatic adsorption film, allowing for efficient and reliable removal without the need for repeated brush movements or high air pressure, ensuring only the correct number of balls are mounted on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If brushes or air are used to relocate excess conductive balls, then excess balls can be moved, but manufacturing efficiency decreases due to repeated operations or high energy consumption
Solution Approach 1:
The patent extracts the excess conductive balls from the mask surface using a removal head with a soft squeegee that collects and removes excess balls in a single operation, eliminating the need for repeated brush movements and significantly improving manufacturing efficiency
Solution Approach 2:
The patent replaces the mechanical brush system with a removal head that uses a soft squeegee to collect and remove excess conductive balls, reducing the number of operations required and improving productivity
2Productivity
If air supply is used to move conductive balls, then balls can be relocated, but energy consumption increases due to high air pressure requirements
Solution Approach 1:
The patent replaces the pneumatic air supply system with a mechanical removal head that uses a soft squeegee to collect and remove excess conductive balls, eliminating high energy consumption while maintaining effective ball relocation
3Productivity
If excess conductive balls remain on the mask, then mounting process can proceed, but reliability decreases due to potential ball misplacement
Solution Approach 1:
The patent extracts excess conductive balls from the mask surface using a removal head with a soft squeegee before the mask is removed from the substrate, ensuring that only the required number of balls remain in position and preventing misplacement, thereby improving reliability
Solution Approach 2:
The patent performs preliminary removal of excess conductive balls from the mask surface before the mask is taken off the substrate, ensuring that ball placement accuracy is maintained and preventing potential misplacement during mask removal
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves manufacturing efficiency by collectively removing excess conductive balls without misplacement, ensuring high reliability in mounting a single ball per connection pad and preventing excess balls from being mistakenly mounted during the process.
Implementation Method 1
excess conductive balls are bonded to an adhesive or electrostatic adsorption film
Implementation Method 2
excess conductive balls are bonded to an adhesive or electrostatic adsorption film
Data Source
Figure 1A~1B
Figure 1C
Figure 2
AI summary
A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask (40) on a substrate (1) including connection pads (C1), the mask (40) having opening portions (40a) corresponding to the connection pad (C1), supplying conductive balls (62) on the mask (40), arranging the conductive balls (62) on the connection pad (C1) of the substrate (1) through the opening portions (40a) of the mask (40) by moving the conductive balls (62) to one end side of the mask (40) by ball moving member 50 (a brush), and removing excess conductive balls (62) remaining on a region of the mask (40) where the opening portions (40a) are provided, by bonding the excess conductive balls (62) to a ball removal film (70) (adhesive film).