Conductive Ball Mounting Apparatus for Simultaneous Placement and Removal
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Solution Overview
Problem
Existing conductive ball mounting methods face challenges in improving productivity due to separate steps for mounting conductive balls on pads and removing extra balls, which increases processing time and can result in defects like displacement, especially with large or thin substrates and small balls.
Innovation Solution
A conductive ball mounting apparatus and method that simultaneously mount and remove conductive balls by using a conductive ball container, substrate holder, and conductive ball supplying unit, where extra balls fall back into the container, and optionally employing a mask with through portions and potential difference to attract balls to pads, allowing for simultaneous processing steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate steps are used for mounting conductive balls on pads and removing extra balls, then the mounting process can be completed, but productivity is reduced due to increased processing time
Solution Approach 1:
The patent combines the mounting step and extra ball removal step into a single integrated process. The conductive ball container is designed with through-holes that allow balls to be mounted on pads while excess balls fall through the container bottom into a collection area, eliminating the need for separate removal operations and reducing total processing time
Solution Approach 2:
The conductive ball container is segmented into distinct functional zones: an upper mounting area with through-holes for ball placement, a middle separation layer, and a lower collection area for excess balls. This segmentation allows simultaneous mounting and removal operations to occur in different spatial zones within the same container structure
2Speed
If rapid vibration is applied to mount solder balls, then mounting speed increases, but the mask and circuit substrate vibrate causing solder ball displacement
Solution Approach 1:
The patent introduces a support plate positioned beneath the mask that counteracts the vibrational forces applied during ball mounting. The support plate provides mechanical stability to the mask-substrate assembly, preventing excessive vibration and solder ball displacement while allowing rapid mounting operations to proceed
Solution Approach 2:
The support plate acts as an intermediary element between the vibration source and the mask-substrate assembly. It mediates the transmission of vibrational forces, allowing controlled vibration for ball mounting while filtering out excessive vibrations that would cause precision errors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces processing time for mounting and removing conductive balls, enhancing productivity and minimizing defects such as displacement, particularly on large or thin substrates with small balls.
Implementation Method 1
a conductive ball supplying unit for moving up a plurality of conductive balls
Implementation Method 2
extra conductive balls, which are not disposed on the pads on which the adhesive is formed, out of the plurality of moved-up conductive balls fall down on the conductive ball container
Data Source
AI summary
In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls.