Partial EMI Shielding Structure for Dense Semiconductor Packaging
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Solution Overview
Problem
The external contact pads on semiconductor devices for electromagnetic interference (EMI) shielding increase the distance between shielded and non-shielded components on a substrate, hindering integration and package density.
Innovation Solution
A partially shielded semiconductor device design is implemented, where internal conductive bars within an encapsulant layer are used to connect shielding layers to conductive patterns, eliminating the need for external contact pads and reducing the distance between shielded and non-shielded components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external contact pads are used for EMI shielding grounding, then shielding function is achieved, but distance between shielded and non-shielded components increases
Solution Approach 1:
The invention extracts the grounding function from external contact pads and relocates it to internal conductive bars within the encapsulant layer. The conductive bars are formed to extend through the encapsulant layer and connect to conductive patterns on the substrate, eliminating the need for external contact pads while maintaining the grounding function for EMI shielding.
Solution Approach 2:
The invention transitions from a two-dimensional planar arrangement where contact pads are placed on the substrate surface to a three-dimensional structure where conductive bars extend vertically through the encapsulant layer. This vertical dimension allows the grounding connection to be made internally within the package structure, reducing the horizontal distance between shielded and non-shielded components.
2Reliability
If external contact pads are used for shielding grounding, then EMI shielding is implemented, but package integration density decreases
Solution Approach 1:
The invention merges the grounding function with the internal package structure by integrating conductive bars and conductive patterns within the encapsulant layer and substrate. This consolidation eliminates separate external contact pads and combines multiple functions (shielding, grounding, and electrical connection) into a unified internal structure, thereby improving package integration density.
3Reliability
If deposition mask is used to form selective shielding layer, then partial shielding is achieved, but manufacturing process complexity increases
Solution Approach 1:
The invention segments the shielding function by applying the shielding layer only to specific regions where EMI protection is needed, using a deposition mask to define the shielded and non-shielded areas. This selective application allows different portions of the package to have different shielding requirements, optimizing both EMI protection and signal integrity while managing manufacturing complexity through targeted deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances integration and reduces the size of semiconductor devices by minimizing the distance between shielded and non-shielded components, improving package density and integration efficiency.
Implementation Method 1
depositing a conductive material on the substrate to form a shielding layer on the substrate which is not covered by the deposition mask
Data Source
AI summary
A method for making a semiconductor device comprises: providing a substrate having a first region and a second region, wherein the first region comprises at least one electronic component and a conductive pattern formed therein; forming a conductive bar on the conductive pattern; forming an encapsulant layer in the first region of the substrate to cover the at least one electronic component, the conductive bar and the conductive pattern; removing a portion of the encapsulant layer that is above the conductive bar to expose the conductive bar and separate the encapsulant layer into a main portion and a peripheral portion; disposing a deposition mask above the substrate to cover the second region; and depositing a conductive material on the substrate to form a shielding layer on the substrate which is not covered by the deposition mask.