Conductive Board Alignment for Reworkable LIDAR Module Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The alignment process of optical transmitter and receiver modules in LIDAR systems is time-consuming and inefficient, especially when dealing with large arrays, and current methods using adhesives and UV curing are cumbersome and limit re-alignment capabilities.
Innovation Solution
The use of conductive alignment devices with semi-rigid metal or metal alloy rods that provide both mechanical and electrical connections between circuit boards, allowing for precise alignment and stable positioning of secondary devices relative to primary circuit boards, enabling faster and more accurate assembly while maintaining the ability for re-alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive bonding and UV curing methods are used to align optical transmitter and receiver modules, then mechanical strength and alignment stability are improved, but assembly time increases and re-alignment capability is lost
Solution Approach 1:
The patent replaces the chemical bonding mechanism (adhesive + UV curing) with a purely mechanical alignment system using conductive members that provide both electrical connection and mechanical positioning. The conductive members engage with alignment features on the circuit boards to precisely position optical modules without requiring chemical bonding processes, thereby eliminating UV curing time while maintaining alignment stability through mechanical engagement.
Solution Approach 2:
The patent incorporates alignment features directly into the circuit board design before assembly, such as precision-machined alignment holes or protrusions that guide the conductive members into exact positions. This preliminary preparation of alignment features enables rapid positioning of optical modules during assembly, eliminating the time-consuming iterative adjustment that would otherwise be needed after adhesive bonding.
2Strength
If adhesive bonding is used to secure optical modules, then mechanical robustness is improved, but re-alignment and re-work capability are eliminated
Solution Approach 1:
The patent creates a dynamic, adjustable alignment system using conductive members that can be positioned and secured without permanent bonding. The conductive members can be inserted, adjusted to achieve precise optical alignment, and then mechanically secured in place. This allows for re-alignment and re-work by simply removing and repositioning the conductive members, eliminating the permanent fixation imposed by adhesive bonding while maintaining sufficient mechanical robustness through the conductive member's structural engagement.
3Manufacturing precision
If multiple alignment adjustments are performed during assembly, then alignment precision is improved, but assembly complexity and time increase
Solution Approach 1:
The patent introduces conductive members as intermediary elements that serve dual functions: providing electrical connection between circuit boards and acting as mechanical alignment tools. These conductive members feature alignment structures (such as guide pins, tapered ends, or engagement features) that automatically establish precise positional relationships between optical modules and circuit boards during a single insertion action, eliminating the need for multiple iterative adjustment steps while maintaining high alignment precision.
Data Source
AI summary
Apparatus and methods for aligning circuit boards (e.g., for LIDAR systems) are disclosed. According to one embodiment, an electronic device comprises a secondary device and a coupling device coupled to the secondary device. The coupling device comprises a plurality of conductive members, including a first conductive member and a second conductive member. Each of the conductive members comprises a first end configured to electrically and mechanically couple to a primary circuit board and a second end electrically and mechanically coupled to the secondary device. Each of the plurality of conductive members has an attribute adjustable in response to a condition being added to the respective conductive member, and is configured to maintain the adjusted attribute after the condition is removed.