Thermally Conductive Body for AC/DC Power Adapter Cooling
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Solution Overview
Problem
Conventional heat dissipation systems for electronic devices, particularly AC/DC power converters, result in bulky device packages due to the need for large heat sinks and inefficient convective cooling, which is inconvenient and prone to high operating temperatures, especially in high-power applications.
Innovation Solution
A compact heat dissipation system that thermally couples a heat conductive body with the power conversion circuit and power supply leads, allowing efficient heat transfer directly to the power supply network, eliminating the need for external cooling apparatus and maintaining structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat sinks and passive convective cooling are used, then heat dissipation is achieved, but device package size increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing power supply leads by thermally coupling them to the power conversion circuit. The leads serve dual purposes: electrical power transmission and heat conduction away from the circuit, eliminating the need for separate heat sinks or cooling apparatus and thereby reducing device package size.
Solution Approach 2:
The power supply leads are given a multi-functional role by utilizing them both for electrical power delivery and for thermal management. This universal use of existing components achieves heat dissipation without adding dedicated cooling components, thus maintaining compact device packaging.
2Loss of energy
If larger heat sinks are used to improve heat transfer, then heat dissipation efficiency increases, but device cost increases
Solution Approach 1:
The system utilizes the power supply leads themselves as the heat conduction pathway, making the existing components serve the heat dissipation function. This self-service approach eliminates the need for additional heat sink materials and assembly, thereby reducing manufacturing complexity and cost while maintaining effective heat transfer.
Solution Approach 2:
By making the power supply leads multi-functional (electrical and thermal), the patent avoids the cost of adding separate heat dissipation components. The existing leads handle both power delivery and heat removal, eliminating material and assembly costs associated with traditional heat sinks.
3Temperature
If passive convective cooling with vents is used, then cooling is achieved, but device package size increases and cooling efficiency decreases
Solution Approach 1:
The patent replaces the convective cooling mechanism (which relies on air flow through vents) with a conductive cooling system where heat is directly conducted away through the thermally conductive leads. This substitution of cooling mechanism achieves more efficient heat removal without requiring large device packages or vent structures.
Solution Approach 2:
The thermally conductive leads act as an intermediary between the power conversion circuit and the external environment, providing a direct thermal pathway for heat removal. This intermediary conduction path is more efficient than convective air cooling and does not require large device packages or vent openings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables compact device packaging while maintaining effective heat dissipation, preventing overheating and ensuring reliable operation, even in high-power applications, by transferring heat generated by the power conversion circuit to the power supply leads and network, thus reducing device size and user safety risks.
Implementation Method 1
a thermally conductive body molded around the power conversion circuit and also around at least a portion of each of the plurality of AC plugs so that the thermally conductive body is thermally coupled with the AC plugs and the AC/DC converter circuit. Thermal energy dissipated in the AC/DC converter circuit is thermally conducted to the AC plugs.
Implementation Method 2
passive convective cooling of the entire system occurs more rapidly than it otherwise would
Data Source
AI summary
An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.