Conductive Bonding Fill Head for Moldless Solder Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current solder ball forming techniques require custom molds for each substrate design, leading to high costs and extended delivery times due to the need for new mold fabrication, and existing molds are limited to rectangular forms with linear motion, which restricts flexibility and efficiency.
Innovation Solution
A system and method for providing conductive bonding material directly onto a circuit supporting substrate using a fill head with linear or rotational motion, eliminating the need for custom molds by allowing the fill head to guide the material into cavities on the substrate, thereby enabling direct deposition of solder or other conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If custom molds are used for each substrate design, then solder ball formation precision is improved, but manufacturing cost and delivery time increase
Solution Approach 1:
The patent applies universality by using a single mold design that can accommodate multiple substrate designs through adjustable positioning mechanisms. The mold includes positioning features that can be reconfigured for different substrate layouts, eliminating the need to create custom molds for each substrate design while maintaining precise solder ball formation.
Solution Approach 2:
The patent applies dynamics by incorporating adjustable and reconfigurable elements in the mold system. The mold positioning mechanisms allow dynamic adjustment of cavity positions and orientations to match different substrate designs, enabling the same mold to adapt to various configurations without requiring physical retooling.
2Productivity
If multiple copies of masks or molds are produced for throughput, then productivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent applies segmentation by dividing the mold into multiple independent cavities that can operate simultaneously. Each cavity can form solder balls on different substrates in parallel, achieving high throughput without requiring multiple complete mold sets. The segmented cavity design allows individual cavities to be used or maintained independently.
3Device complexity
If rectangular molds with linear movement are used, then device complexity is reduced, but adaptability to different substrate designs is limited
Solution Approach 1:
The patent applies dynamics by incorporating adjustable and reconfigurable elements in the mold system. The mold positioning mechanisms allow dynamic adjustment of cavity positions and orientations to match different substrate designs, enabling the same mold to adapt to various configurations without requiring physical retooling.
Solution Approach 2:
The patent applies dimensionality change by adding rotational capability to the mold system. The mold can rotate to align with different substrate orientations, and cavities can be positioned in multiple dimensional arrangements, transforming a simple linear mold into a versatile multi-axial system that accommodates various substrate layouts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the cost and time associated with mold production and allows for flexible substrate designs, enabling efficient solder deposition and creation of solderable connections between substrate layers without the need for multiple mold iterations.
Implementation Method 1
A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate.
Data Source
AI summary
A system, method, and apparatus of providing conductive bonding material into a plurality of cavities in a circuit supporting substrate is disclosed. The method comprises placing a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Conductive bonding material is forced out of the fill head toward the circuit supporting substrate. The conductive bonding material is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head.