Conductive Bonding Tape for PIM Reduction in Communication Devices
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Solution Overview
Problem
Passive intermodulation (PIM) occurs in communication devices, leading to interference between uplink and downlink channel signals, which reduces communication service radius and efficiency, thereby deteriorating communication quality.
Innovation Solution
An electrically conductive bonding tape is developed, comprising an electrically conductive first adhesive layer with dispersed conductive particles, a second adhesive layer with non-woven elongated conductive fibers, and a compressible spongy layer. This tape reduces PIM by ensuring electrical conductivity and mechanical compliance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional bonding materials are used, then mechanical bonding is achieved, but passive intermodulation occurs causing communication quality deterioration
Solution Approach 1:
The patent changes the electrical conductivity parameter of the bonding tape from insulative to conductive by incorporating conductive particles and fibers. This parameter change eliminates the harmful passive intermodulation effect while maintaining mechanical bonding functionality, thereby resolving the contradiction between achieving reliable mechanical bonding and preventing communication quality deterioration
Solution Approach 2:
The patent uses composite materials consisting of conductive particles, conductive fibers, and adhesive matrix to create a bonding tape that simultaneously provides mechanical bonding and electrical conductivity. This composite structure prevents passive intermodulation while maintaining bonding reliability, addressing the contradiction between mechanical bonding and communication quality
2Reliability
If conductive particles are dispersed in adhesive material, then electrical conductivity is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs local quality by using conductive fibers in the second adhesive layer that naturally distribute conductive pathways without requiring uniform particle dispersion throughout the entire material. The fibers provide localized conductivity where needed, reducing the manufacturing precision requirements for overall uniformity while maintaining reliable electrical conductivity
Solution Approach 2:
The conductive fibers act as intermediaries that bridge the gap between conductive particles and the adhesive matrix. These fibers facilitate electrical conductivity formation more easily than requiring perfect particle dispersion, thereby reducing manufacturing precision requirements while ensuring reliable electrical conductivity
3Adaptability or versatility
If spongy layer compresses significantly, then mechanical compliance is improved, but structural stability deteriorates
Solution Approach 1:
The patent applies dynamics by designing the spongy layer with controlled compressibility that can dynamically adapt to bonding surface irregularities during assembly. The layer compresses to provide mechanical compliance and then maintains its compressed state to ensure stable electrical contact, achieving both adaptability and stability through dynamic behavior
Solution Approach 2:
The patent changes the physical state of the spongy layer from uncompressed to compressed during bonding, utilizing this parameter change to achieve both mechanical compliance (during compression) and structural stability (after compression). The controlled compression ratio ensures the layer maintains stability while providing necessary compliance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electrically conductive bonding tape effectively reduces passive intermodulation, enhancing communication quality by minimizing interference and maintaining efficient communication services.
Implementation Method 1
an electrically conductive first adhesive layer including opposing first and second major surfaces and electrically conductive along at least a thickness direction... including a substantially electrically insulative first adhesive material and pluralities of electrically conductive first and second particles dispersed in the first adhesive material
Implementation Method 2
an electrically conductive compressible spongy layer disposed on the second, opposite the first, major surface of the first adhesive layer... in response to a first compressive force, the spongy layer compresses by about 30%-50% inclusive of a normal thickness of the spongy layer and regains about 60%-95% inclusive of a normal thickness of the spongy layer after the first compressive force is removed
Data Source
AI summary
The disclosure relates to an electrically conductive bonding tape and an electronic device including the same. Specifically, according to an embodiment of the disclosure, there is provided an electrically conductive bonding tape, including an electrically conductive first adhesive layer including opposing first and second major surfaces and electrically conductive along at least a thickness direction, the first adhesive layer having an average thickness t and including a substantially electrically insulative first adhesive material and pluralities of electrically conductive first and second particles dispersed in the first adhesive material, the first and second particles having respective average thickness t1 and t2, t1/t being 0.7-0.95 inclusive, t2/t being 0.2-0.7 inclusive.