Thermally Conductive Braided Fabric for LED Heat Dissipation

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Conventional heat dissipation methods for high-power LED chips face challenges due to increased size and bulkiness of heat sinks, leading to inefficient heat transfer and temperature rise issues, which hinder the rapid development of LED lighting technology.

Innovation Solution

A braided fabric made from thermally conductive wire material with a diameter between 0.01 mm and 2 mm is used to create a compact heat exchange apparatus, where the fabric is welded or adhered to a heat generating object, and air flow is utilized to dissipate heat through convection, reducing the volume and weight of the heat dissipation system.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heat sinks are increased in size to increase heat dissipation surface area, then heat dissipation capacity is improved, but device volume and weight increase significantly

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidheat sink volume

Core Design Contradiction:

TemperatureVSVolume of moving object

Solution Approach 1:

The heat dissipation system is segmented into multiple thin-walled tubular structures arranged in parallel, each contributing to heat dissipation. This segmentation allows achieving large effective heat dissipation surface area without requiring a single large bulky heat sink, thus improving heat dissipation capacity while controlling volume.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The invention transitions from conventional planar heat sink surfaces to three-dimensional tubular structures with internal fluid flow paths. This dimensional change enables heat dissipation to occur through both external convection and internal fluid conduction, significantly increasing effective heat dissipation surface area within compact volume.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If heat sink size is increased to improve heat dissipation, then heat dissipation surface area increases, but heat transfer efficiency decreases due to increased distance from heat generating element

Engineering Contradiction:

Improveheat dissipation surface areaVSAvoidheat transfer efficiency

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The heat generating element is nested within or directly coupled to the tubular heat dissipation structures, minimizing the distance between heat source and dissipation surfaces. This nested arrangement ensures efficient heat transfer from the heat generating element to the heat dissipation surfaces while maintaining compact overall dimensions.

Inventive Principle:

Principle #7Nested doll (Nesting)

3Power

If conventional heat dissipation methods are used for high-power LED chips, then heat dissipation is achieved, but temperature control becomes difficult and development is hindered

Engineering Contradiction:

ImproveLED chip powerVSAvoidtemperature control

Core Design Contradiction:

PowerVSTemperature

Solution Approach 1:

The invention incorporates fluid circulation through the tubular heat dissipation structures, using hydraulic principles to efficiently remove heat from high-power LED chips. The fluid flow actively carries heat away from the LED chips, providing superior temperature control compared to passive air cooling, enabling higher power operation with effective thermal management.

Inventive Principle:

Principle #29Pneumatics and hydraulics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach significantly reduces the volume and weight of heat dissipation systems by allowing effective heat transfer to a large surface area with minimal distance, effectively controlling temperature rise below 25°C for high-power LED chips, thus overcoming the limitations of conventional methods.

Implementation Method 1

heat is conducted on the thermally conductive wire material of the thermally conductive braided fabric

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

air or other fluids are heated or cooled by means of a surface of the thermally conductive wire material, and the heat is dissipated or absorbed by convection

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS11085626B2Apparatus for heat exchange by using braided fabric woven from thermally conductive wire material

Publication Date: 2021.08.10 ZHANG YIXING

AI summary

There are provided an apparatus for heat exchange by using a braided fabric woven from a thermally conductive wire material and a light emitting diode (LED) lighting device. The apparatus comprises a braided fabric (1) woven from a thermally conductive wire material, and a heat dissipating or absorbing object (2) is fixed with the braided fabric (1) by using methods such as welding, adhering with a thermally conductive adhesive and casting, so as to ensure that heat energy is effectively conducted between the heat dissipating or absorbing object (2) and the thermally conductive wire of the braided fabric (1), and heat is dissipated to air or absorbed from air by means of a heat dissipating surface of the thermally conductive wire of the braided fabric (1).