Conductive Bump Structure for Reliable LED Die Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in precisely placing millions of LED dies on a display panel with fast and reliable die transfer technology, given their small size and increasing brightness, which requires efficient conductive bump structures and manufacturing methods to ensure reliable electrical and physical connections.
Innovation Solution
A semiconductor device arrangement featuring a substrate with an adhesive structure and conductive bumps, where the conductive bumps have distinct portions to minimize contact with the adhesive, allowing for reduced contact areas and improved transferability, utilizing low melting point metals or alloys for the bumps and various materials for electrodes and adhesives to enhance reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the conductive bump is fully embedded in the adhesive structure, then the electrical connection is improved, but the transferability and ease of removal deteriorates
Solution Approach 1:
The conductive bump is segmented into two distinct portions: a first portion embedded in the adhesive structure for electrical connection, and a second portion extending outward for transferability. This segmentation allows the bump to fulfill both functions simultaneously - the embedded first portion ensures reliable electrical connection while the external second portion enables easy grasping and transfer by the transferring structure.
2Strength
If the contact area between semiconductor device and adhesive structure is increased, then the fixing strength is improved, but the transferability deteriorates
Solution Approach 1:
The contact interface is segmented into two functional zones: the first portion of the conductive bump that contacts the adhesive structure provides fixing strength through adequate contact area, while the second portion that extends outward provides a non-contact zone that enables easy transfer by the gripping structure without excessive adhesion.
3Reliability
If more conductive bumps are used for electrical connection, then the electrical reliability is improved, but the device complexity increases
Solution Approach 1:
The conductive bump is designed as a multi-functional element that simultaneously serves electrical connection (through the embedded first portion) and mechanical transfer (through the external second portion). This universal design eliminates the need for separate transfer structures or additional components, reducing overall device complexity while maintaining electrical reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables precise placement and reliable electrical connections of LED dies, improving the probability of open circuit reduction and fixing strength between the semiconductor device and the circuit substrate, facilitating efficient transfer and integration in next-generation displays.
Implementation Method 1
the first portion contacts the first concave region, and the second portion does not contact the first concave region
Implementation Method 2
Providing an energy to the first semiconductor device such that a contact area between the first semiconductor device and the adhesive structure is reduced
Data Source
AI summary
An embodiment of the present disclosure provides a semiconductor device arrangement. This arrangement includes a substrate, an adhesive structure, and a first semiconductor device. The substrate includes an upper surface. The adhesive structure is located on the upper surface and includes a first concave region. The first semiconductor device includes a lower surface facing toward the adhesive structure and a conductive bump located under the lower surface and in the first concave region. The conductive bump includes a first portion and a second portion. Wherein the lower surface does not contact the adhesive structure, the first portion contacts the first concave region, and the second portion does not contact the first concave region.