Conductive Bump Shielding for Miniaturized Electronic Modules
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Solution Overview
Problem
The miniaturization of electronic modules poses challenges in effectively implementing electromagnetic shielding due to the difficulty and expense of creating shielding structures within tight spaces, leading to potential performance degradation and malfunction from electromagnetic interference.
Innovation Solution
An electronic module design featuring a first substrate with electronic elements and connection pads, a second substrate with a conductive film and conductive bumps aligned with the connection pads, and a ground plane for electrical connection, along with an insulating adhesive to fill gaps, providing a flexible and cost-effective electromagnetic shielding structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electromagnetic shielding structures are implemented in miniaturized electronic modules, then electromagnetic interference protection is improved, but manufacturing difficulty and cost increase due to tight space constraints
Solution Approach 1:
The shielding structure is divided into multiple conductive bumps distributed on the second substrate, each connecting to specific connection pads. This segmentation allows the shielding function to be implemented through discrete, manageable elements rather than a continuous complex structure, facilitating easier manufacturing in miniaturized modules
Solution Approach 2:
The invention transitions from planar shielding structures to three-dimensional conductive bumps that protrude from the substrate surface. This dimensional change enables effective shielding within vertical space, allowing compact integration without requiring extensive lateral space, thus resolving the manufacturing difficulty in tight spaces
2Reliability
If traditional electromagnetic shielding structures are implemented in miniaturized electronic modules, then electromagnetic interference protection is improved, but manufacturing cost increases
Solution Approach 1:
The invention changes the geometric parameters of the shielding elements by using conductive bumps with specific height, diameter, and distribution patterns. These parameter optimizations enable effective shielding performance while using minimal material quantities, reducing manufacturing cost compared to traditional extensive shielding structures
Solution Approach 2:
The invention extracts only the essential shielding elements (conductive bumps at strategic locations) rather than implementing complete traditional shielding enclosures. This extraction approach maintains necessary electromagnetic interference protection while eliminating excess materials and manufacturing steps, thereby reducing cost
3Volume of moving object
If electronic modules are miniaturized, then device size is reduced, but electromagnetic interference disturbance worsens due to tighter spacing between circuits
Solution Approach 1:
The invention applies shielding selectively at local positions where electromagnetic interference is most critical, rather than providing uniform shielding throughout the entire module. The conductive bumps are strategically placed near sensitive electronic elements and connection pads, providing targeted protection while maintaining miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves effective electromagnetic shielding in small spaces, enhancing the performance and reliability of miniaturized electronic modules by integrating a simplified, flexible, and cost-effective shielding method with high yield rates.
Implementation Method 1
The conductive bump is connected to the connection pad
Implementation Method 2
a gap between the first substrate and the second substrate is filled with an insulating adhesive
Implementation Method 3
The connection pad is electrically connected to a ground pin of the electronic module through a via connection in the first substrate
Data Source
AI summary
An electronic module having an electromagnetic shielding structure and its manufacturing method are provided. At first, a first substrate and a second substrate are separately provided. At least one electronic element and at least one connection pad are formed on a surface of the first substrate. The second substrate includes a conductive film and at least one conductive bump is formed on a surface of the conductive film. The first substrate and the second substrate are laminated together wherein the conductive bump is aligned with and connected to the connection pad to obtain the electronic module.