Conductive Cap Sensor Module for Simplified PCB Assembly
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Solution Overview
Problem
Existing sensor modules, particularly those with micro-electro-mechanical microphones, face challenges in miniaturization and require complex connection procedures, such as wire-bonding or through-hole forming, which are cumbersome and difficult to fabricate efficiently.
Innovation Solution
A sensor module design featuring a cap made of electrically conductive material with semiconductor chips attached, where the cap serves both as a mechanical protection and electrical shielding, allowing for easy mounting on a circuit board without the need for initial electrical connections between the chips, enabling simplified fabrication and reduced complexity in assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire-bonding or through-hole forming is used to connect chips, then electrical connections are established, but fabrication complexity and difficulty increase
Solution Approach 1:
The patent applies preliminary action by pre-attaching the semiconductor chips to the cap before mounting on the circuit board. The cap serves as a temporary carrier that holds the chips in position, eliminating the need for complex wire-bonding or through-hole forming operations. The chips are preliminarily positioned and connected to the cap's contact elements, which then connect to the circuit board upon mounting, simplifying the overall fabrication process while maintaining reliable electrical connections
Solution Approach 2:
The cap acts as an intermediary element between the semiconductor chips and the circuit board. It provides contact elements that establish electrical connections with the chips and simultaneously serves as a mounting interface for the circuit board. This intermediary structure eliminates the need for direct complex connections between chips and the board, reducing fabrication complexity while ensuring reliable electrical pathways
2Volume of moving object
If multiple components are integrated in a compact sensor module, then miniaturization is achieved, but assembly complexity increases
Solution Approach 1:
The patent merges multiple functions into the cap structure. The cap simultaneously serves as a mechanical protective enclosure, a carrier for semiconductor chips, an electrical connection interface through its contact elements, and a mounting interface for the circuit board. By combining these functions into a single integrated component, the overall device complexity is reduced despite the compact integration of multiple components in the sensor module
Solution Approach 2:
The cap is designed as a multi-functional universal component that performs multiple roles: mechanical protection of internal components, electrical connection through contact elements, structural support for mounting chips and the circuit board, and shielding. This universal design approach reduces the total number of separate components needed, simplifying assembly while achieving miniaturization of the sensor module
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process by eliminating the need for initial chip connections, facilitating easier integration with circuit boards and providing effective electrical shielding against spurious signals, while maintaining the ability to transform sound into electrical signals effectively.
Implementation Method 1
a micro-electro-mechanical microphone which dynamically transforms sound e.g., in the audible frequency range into electrical signals. One embodiment of a module may include a silicon chip containing a microphone based on a capacitor including two electrodes wherein one electrode is made of a thin membrane
Implementation Method 2
The sensor module includes a cap made of electrically conductive material... providing effective electrical shielding against spurious signals
Data Source
AI summary
A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane.