Conductive Carrier Power Switch Coupling
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Solution Overview
Problem
Power converter packaging solutions require large conductive clips for high current connections, which increase size and sensitivity to electrical resistance, necessitating robust and bulky designs to accommodate these clips.
Innovation Solution
A semiconductor package design that uses a conductive carrier, such as a lead frame, to directly couple control and sync power switches, eliminating the need for a conductive clip and providing a low resistance, parasitic-free electrical connection through a conductive carrier and die attach material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large conductive clip is used to connect control and sync power switches, then the electrical connection can accommodate high current, but the package size increases and the design becomes bulky
Solution Approach 1:
The patent merges the functions of the conductive clip and the die attach material by using the same conductive carrier (lead frame) to both attach the power switches to the substrate and provide the electrical connection between control and sync switches. This eliminates the need for a separate conductive clip, reducing package size while maintaining electrical connection reliability for high current applications.
2Reliability
If a large cross-sectional area conductive clip is used, then electrical resistance sensitivity is reduced, but the package must be sized larger to accommodate the clip
Solution Approach 1:
The invention combines the electrical connection function with the mechanical attachment function by using the lead frame's conductive carrier to both mount the power switches and provide the low-resistance electrical path. This integrated approach achieves low electrical resistance without requiring additional space for a separate large conductive clip.
3Reliability
If a separate conductive clip is used to connect power switches, then the electrical connection is provided, but the device complexity increases
Solution Approach 1:
The patent extracts the electrical connection function from a separate component (conductive clip) and integrates it into the existing die attach structure (lead frame). This simplification eliminates unnecessary components and reduces packaging structure complexity while maintaining reliable electrical connections between power switches.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a compact, reliable, and low-parasitic electrical connection for power converter switch nodes, reducing package size and improving efficiency by eliminating the need for large conductive clips.
Implementation Method 1
providing a low resistance, parasitic-free electrical connection through a conductive carrier and die attach material
Implementation Method 2
eliminating the need for a conductive clip and providing a low resistance, parasitic-free electrical connection through a conductive carrier and die attach material
Data Source
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AI summary
In one implementation, a semiconductor package including conductive carrier coupled power switches includes a first vertical FET in a first active die having a first source and a first gate on a source side of the first active die and a first drain on a drain side of the first active die. The semiconductor package also includes a second vertical FET in a second active die having a second source and a second gate on a source side of the second active die and a second drain on a drain side of the second active die. The semiconductor package includes a conductive carrier attached to the source side of the first active die and to the drain side of the second active die, the conductive carrier coupling the first source to the second drain.