Conductive Ceramic Electrode for Homogeneous Clamping
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Solution Overview
Problem
Conventional electrostatic holding apparatuses for components like silicon wafers have complex production processes due to embedded electrodes, leading to inhomogeneous force distribution and high clamping voltage requirements, which can change over time.
Innovation Solution
A holding apparatus with a first plate made of electrically conductive silicon-based ceramic serving as both the electrode and support, connected to a second insulating plate via high-temperature soldering, eliminating the need for separate electrodes and improving robustness and thermal coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrodes are embedded into the first plate as in conventional electrostatic holding apparatuses, then the electrostatic holding function is achieved, but the production becomes complex and the electrode connections require separate embedding processes
Solution Approach 1:
The first plate is made from electrically conductive silicon-based ceramic material that inherently provides both mechanical support and electrostatic holding functions. The entire first plate serves as the electrode, eliminating the need for separate embedded electrodes and their complex connection processes. This merging of structural and functional elements simplifies production while maintaining reliable electrostatic holding.
Solution Approach 2:
The first plate performs multiple functions simultaneously: it provides mechanical support structure, serves as the electrostatic electrode, and enables thermal coupling. By making the first plate itself electrically conductive through silicon-based ceramic material, it becomes a multi-functional component that replaces what were previously separate elements (support structure + embedded electrodes + connections).
2Reliability
If multiple separate electrodes are embedded in the first plate, then electrostatic holding is achieved, but the electrostatic holding forces become distributed inhomogeneously and may change over time
Solution Approach 1:
The first plate is made from electrically conductive silicon-based ceramic material that provides uniform electrical properties throughout its entire surface area. This ensures homogeneous electrostatic field distribution across the whole plate, eliminating the inhomogeneous force distribution that occurs with discrete embedded electrodes. The local quality of electrical conductivity is consistent across the entire first plate.
Solution Approach 2:
Instead of embedding discrete electrodes into an insulating plate as in conventional designs, the invention inverts the approach by making the plate itself electrically conductive. This reversal of the conventional structure (from insulating plate with embedded electrodes to conductive plate) naturally ensures uniform charge distribution and homogeneous electrostatic forces across the entire surface.
3Device complexity
If embedded electrodes are used at a relatively large distance from the component, then the holding apparatus structure is simplified, but high clamping voltage is required
Solution Approach 1:
The invention extracts the distance barrier between electrode and component by making the first plate itself the electrode. This eliminates the need for separate embedded electrodes that require connection leads and insulation layers, thereby reducing the effective distance to the component surface and lowering the required clamping voltage while maintaining structural simplicity.
4Ease of manufacture
If conventional embedding processes are used for electrodes, then the holding apparatus can be assembled, but the production time increases and manufacturing complexity arises
Solution Approach 1:
The invention segments the manufacturing process by providing the first plate as a pre-fabricated electrically conductive component that requires no further electrode embedding or connection work. The first plate is manufactured separately with its electrical conductivity already integrated into the material structure, allowing it to be directly assembled into the holding apparatus without time-consuming embedding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies production, reduces clamping voltage, ensures homogeneous force distribution, and enhances longevity and thermal matching, reducing time-dependent holding force effects.
Implementation Method 1
The holding apparatus has a first electrode (upper electrode) which is arranged to receive a clamping voltage. The first plate is produced from an electrically conductive, silicon-including (Si-based) ceramic, and the first electrode is formed by the first plate
Implementation Method 2
The second plate, which is made of an electrically insulating material, carries the first plate
Data Source
AI summary
A holding apparatus (100) for electrostatically holding a component (1), in particular a silicon wafer, includes at least one base body (10, 10A, 10B) which is composed of a first plate (11A) and a second plate (12), the first plate (11A) being arranged on an upper side (10A) of the base body (10, 10A, 10B) and the second plate are made of an electrically insulating material, a plurality of projecting, upper burls (13A) which are arranged on the upper side (10A) of the base body (10, 10A, 10B) and form a support surface for the component (1), and a first electrode which is arranged to receive a clamping voltage, wherein the first plate (11A) is made of an electrically conductive, silicon-including ceramic and forms the first electrode. A method for producing the holding apparatus (100) is also described.