Electronic Component Module Shielding via Conductive Chip
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Solution Overview
Problem
Existing electronic component modules with conductive posts face limitations in conductivity and shielding effectiveness, particularly in high-density mounting and orthogonal shielding, due to the restricted formation of shield surfaces.
Innovation Solution
The use of conductive chip components connected to grounding terminals and integrated within a concave portion of an insulating sealing resin, with a conductive film covering the resin and chip components, enhances electromagnetic shielding while allowing for higher density mounting without additional space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive post is used to connect the surface mount component and the shield layer, then the component can be connected to ground, but the conductivity is limited and the shielding property deteriorates
Solution Approach 1:
The patent changes the material parameter from conductive post (resin-filled) to conductive chip component (metal), fundamentally altering the conductivity parameter. This material substitution enables achievement of both high conductivity and high shielding effectiveness simultaneously
Solution Approach 2:
The conductive chip component replicates the grounding function of the conductive post but with superior electrical properties. The metal-based conductive chip provides a low-impedance path to ground that effectively suppresses electromagnetic interference, copying and improving upon the original design
2Area of stationary object
If a conductive post is used, then the component can be grounded, but it can be formed only on the terminal of the surface mounting component, making it difficult to enlarge the shield surface
Solution Approach 1:
The patent transitions from a one-dimensional conductive post (vertical connection only) to a two-dimensional conductive chip component with top and side surfaces. This dimensional expansion allows the shield surface to extend in multiple directions, enabling larger effective shielding area without increasing component footprint
Solution Approach 2:
The conductive chip component is designed with segmented surfaces (top surface and side surfaces) that can independently contribute to shielding. This segmentation allows flexible configuration of shield surfaces to cover different areas while maintaining manufacturing simplicity
3Productivity
If the conductive chip component is disposed on the electronic component, then high-density mounting is facilitated, but the concave portion depth must be controlled to prevent conductive film thinning
Solution Approach 1:
The patent applies local quality by creating a concave portion only in the sealing resin where the conductive chip component is disposed, rather than modifying the entire structure. This localized modification allows the conductive chip component to be exposed for electrical connection while maintaining the overall sealing structure integrity and controlling the depth to prevent conductive film thinning
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves electromagnetic field shielding properties by reducing resistance and enabling larger shield surfaces, facilitating high-density electronic component mounting and maintaining effective shielding without thinning the conductive film.
Implementation Method 1
the conductive chip component is connected to a grounding terminal of the first electronic component... electromagnetic field shielding properties can be realized
Implementation Method 2
The conductive film covers an outer surface of the sealing resin... electromagnetic field shielding properties can be realized
Data Source
AI summary
An electronic component module includes a substrate, a plurality of electronic components, an insulating sealing resin, a conductive film, and a conductive chip component. The plurality of electronic components includes an electronic component having a grounding terminal at a side end portion, and are mounted on the main surface of the substrate. The sealing resin covers the plurality of electronic components and the main surface side of the substrate. The conductive film covers the outer surface of the sealing resin. The conductive chip component is disposed on a side of the electronic component opposite to the substrate in a normal direction of the main surface, and is connected to a grounding terminal of the electronic component. The conductive film is connected to the conductive chip component.