Conductive Clip Connections for High Power Semiconductor Packages
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Solution Overview
Problem
Conventional bond wire connections in semiconductor packages have low current carrying capacity, high resistance, and high inductance, making them unsuitable for high power applications, necessitating the need for more efficient electrical connections.
Innovation Solution
The use of electrically conductive clips with specific geometric configurations, such as planar portions and arcuate extensions, to connect semiconductor die pads to a conductive paddle and perimeter leads, optimizing current carrying capacity, resistance, and inductance, while maintaining compatibility with existing quality control processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If bond wires are used to connect die pads to leads, then the package structure is simple and easy to manufacture, but the current carrying capacity is low and resistance is high
Solution Approach 1:
The connection structure is divided into multiple segments: bond wires for signal connections and separate conductive clips for power connections. This segmentation allows each component to be optimized for its specific function - bond wires for fine-pitch signaling and conductive clips for high-current power delivery, thereby increasing overall current carrying capacity without complicating the entire connection system.
Solution Approach 2:
The patent combines multiple connection methods (bond wires and conductive clips) into a single hybrid connection system. The conductive clips are integrated with the leadframe structure and work in conjunction with bond wires to provide both mechanical support and electrical connection, thereby increasing current carrying capacity while maintaining manufacturing simplicity.
2Reliability
If bond wires are used for electrical connections, then the manufacturing process is simple, but the inductance is high making them unsuitable for high power applications
Solution Approach 1:
Different connection technologies are applied to different locations based on functional requirements: bond wires are used for signal connections where low inductance is less critical, while conductive clips with low-inductance geometry are used for power connections where low inductance is critical. This local differentiation improves reliability for high power applications without significantly complicating the overall manufacturing process.
Solution Approach 2:
The conductive clips feature curved or arcuate geometries that are specifically designed to minimize loop area and inductance. The curved shapes allow current to flow in a more direct path and reduce parasitic inductance, making the connections suitable for high power applications while maintaining ease of manufacture through standard clip formation processes.
3Reliability
If conventional connection methods are used, then the manufacturing process is straightforward, but the resistance is high reducing electrical performance
Solution Approach 1:
The patent merges bond wire connections with conductive clip connections in a hybrid architecture. The conductive clips provide low-resistance paths for high current while bond wires handle signal connections. This combination improves electrical performance by providing multiple parallel current paths with lower overall resistance, while the manufacturing process remains relatively straightforward by integrating clip attachment into existing leadframe fabrication.
Data Source
AI summary
Conductive clip connection arrangements for semiconductor packages are disclosed. Some examples provide electrically conductive clip connection arrangements for semiconductor packages that improve electrical performance and fabrication reliability while maintaining compatibility with existing quality control processes. Some examples provide innovative conductive clip structures and die pad arrangements that broaden the range of options available for tailoring the physical configurations of one or more of the constituent conductive clips and/or die pads to achieve specific electrical performance targets.