Thermally Conductive Coating on Component Carrier Base Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing miniaturization and power of electronic components on component carriers poses challenges in efficiently removing heat generated during operation, while maintaining mechanical robustness and electrical reliability, especially for components that produce significant heat.
Innovation Solution
A component carrier with a thermally highly conductive coating applied to the base structure, which is strategically positioned close to the embedded components to form an efficient heat removal path, utilizing materials like diamond-like carbon, graphene, or high thermal conductivity prepreg, allowing for continuous and uninterrupted heat dissipation without significant modification to existing manufacturing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If components are miniaturized and more components are mounted on the component carrier, then product functionalities and power increase, but heat removal becomes increasingly difficult
Solution Approach 1:
The patent applies a thermally highly conductive coating specifically to the base structure surface in the region where the component is mounted, rather than uniformly throughout the entire component carrier. This localized application creates a thermal pathway precisely where heat generation occurs, enabling efficient heat removal from the component contact region while maintaining the structural integrity and functionality of the overall carrier.
Solution Approach 2:
The patent employs a composite structure combining the base structure material with a thermally highly conductive coating material. This composite approach allows the base structure to provide mechanical support and electrical functionality while the coating layer provides enhanced thermal conduction properties, effectively addressing both structural and thermal requirements simultaneously.
2Temperature
If a thermally highly conductive coating is applied to the base structure, then heat removal efficiency improves, but manufacturing complexity increases
Solution Approach 1:
The thermally highly conductive coating is applied to the base structure surface before the component is mounted in the recess. This preliminary action allows the coating to be integrated into the manufacturing process flow without requiring additional steps after component placement, thereby minimizing manufacturing complexity while achieving the thermal management objective.
3Temperature
If the coating is positioned close to the embedded component, then thermal coupling and heat dissipation improve, but mechanical robustness may be compromised
Solution Approach 1:
The patent uses a thin film coating applied to the base structure surface, which provides effective thermal coupling with the embedded component while maintaining mechanical robustness. The thin film configuration allows sufficient thermal conduction proximity to the component without compromising the structural strength of the base structure, as the coating layer is thin enough to not interfere with mechanical integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces thermal stress and operating temperatures by providing a high thermal performance that is mechanically robust and electrically reliable, enhancing the reliability of component carriers and preventing overheating issues.
Implementation Method 1
a thermally highly conductive coating (or lining or film or layer structure) covering at least a part of a surface of the base structure
Data Source
AI summary
A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess.