Conductive Coating Composition for Low-Roughness Resist Laminates
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Solution Overview
Problem
Conductive compositions used in electron-beam lithography for semiconductor devices face issues with surface roughness, clogging during filtration, and migration of acidic substances, leading to reduced film thickness and pattern deformation, which are not adequately addressed by existing technologies.
Innovation Solution
A conductive composition with a specific conductive polymer and surfactant formulation, including a water-soluble polymer with a nitrogen-containing functional group and a terminal hydrophobic group, and a basic compound with a conjugated structure, which reduces surface roughness and minimizes the migration of acidic substances, thereby improving coating performance and film stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a conductive composition containing a water-soluble conductive polymer and surfactant is used to form a conductive coating film on resist, then coating performance is improved, but surface roughness increases leading to pattern deformation
Solution Approach 1:
The patent changes the molecular weight parameter of the water-soluble polymer from conventional ranges to specifically 10,000-1,000,000, and adjusts the surfactant concentration to 0.01-5 mass%, optimizing these parameters to achieve both good coating performance and low surface roughness
Solution Approach 2:
The patent creates a composite conductive composition by combining a water-soluble conductive polymer with a specific water-soluble polymer and surfactant, where each component contributes different properties: the conductive polymer provides conductivity, the polymer provides solubility and film-forming ability, and the surfactant provides surface activity, achieving a balance between coating performance and surface smoothness
2Manufacturing precision
If microfiltration is applied to remove contaminants from conductive composition, then pattern quality is improved, but filter clogging occurs frequently reducing productivity
Solution Approach 1:
The patent performs preliminary purification by removing contaminants before the conductive composition is applied to the resist, preventing filter clogging during subsequent filtration steps and maintaining high productivity throughout the manufacturing process
Solution Approach 2:
The patent changes the molecular weight parameter of the water-soluble polymer to 10,000-1,000,000, which optimizes the composition's filtration characteristics, reducing clogging during microfiltration while maintaining pattern quality
3Ease of operation
If additives such as anionic or cationic surfactant are added to improve coating performance, then coating uniformity is improved, but acid or base from surfactant adversely affects resist properties causing pattern formation failure
Solution Approach 1:
The patent uses a water-soluble polymer with nitrogen-containing functional groups that can be easily removed or neutralized, providing temporary surfactant-like functionality during coating without leaving harmful residues that would affect resist properties
Solution Approach 2:
The patent carefully controls the surfactant concentration at 0.01-5 mass%, which is sufficient to improve coating uniformity but low enough to minimize the adverse effects of acid or base from the surfactant on resist properties
4Reliability
If conductive composition is applied to form conductive coating film, then electrical conductivity is improved, but acidic substances migrate to resist layer causing film thickness reduction
Solution Approach 1:
The patent introduces a water-soluble polymer with nitrogen-containing functional groups as an intermediary substance that interacts with acidic substances in the conductive composition, preventing their migration to the resist layer while maintaining the electrical conductivity of the coating film
Solution Approach 2:
The patent creates a composite structure where the water-soluble conductive polymer is combined with a water-soluble polymer and surfactant, forming a multi-component system where the polymer matrix traps acidic substances and prevents their migration, thus preserving both conductivity and film thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a conductive coating film with reduced surface roughness and minimal film thickness reduction, enhancing the performance of semiconductor devices by preventing pattern deformation and maintaining stability under high temperatures.
Implementation Method 1
a surfactant (B), wherein the surfactant (B) contains a water-soluble polymer (C) having a nitrogen-containing functional group and a terminal hydrophobic group
Implementation Method 2
the surface roughness (Ra1 value) of the conductive coating film measured by a stylus profiler is 0.7 nm or less, the surface roughness (Ra2 value) of the conductive coating film measured by a scanning probe microscope is 0.35 nm or less
Implementation Method 3
a basic compound (E3), wherein the basic compound (E3) has a basic group and two or more hydroxyl groups in the molecule, the melting point of the basic compound (E3) is 30° C. or more, and the content of the basic compound (E3) in the conductive composition is 0.6 to 0.8 mol relative to 1 mol of the monomer unit having an acidic group of the conductive polymer (A1)
Implementation Method 4
the basic compound (E3) has a basic group and two or more hydroxyl groups in the molecule
Implementation Method 5
maintaining stability under high temperatures
Implementation Method 6
the melting point of the basic compound (E3) is 30° C. or more
Data Source
AI summary
The present invention relates to a conductor having a substrate and a conductive coating film laminated on the substrate, wherein, the surface resistance value of the conductive coating film is 5×1010Ω/□ or less, the Ra1 of the conductive coating film is 0.7 nm or less, the Ra2 value of the conductive coating film scanning probe microscopies 0.35 nm or less, and the conductive coating film is formed with a conductive composition containing a conductive polymer (A). In addition, the present invention relates to a conductive composition which contains a conductive polymer (A) and a surfactant (B), wherein the surfactant (B) contains a specific water-soluble polymer (C), and the content of a compound (D1) with an octanol-water partition coefficient (Log Pow) of 4 or more in the conductive composition is 0.001 mass % or less, relative to the total mass of the conductive composition.