Conductive Coating on Solder Mask for EMI Shielding
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Solution Overview
Problem
Electronic components are vulnerable to electromagnetic interference (EMI), which can disrupt their operation, and existing solutions do not adequately address the need for effective shielding and heat dissipation.
Innovation Solution
A shielded electronic component package is created with an electrically conductive coating applied to the solder mask, extending into openings to contact terminals and providing a ground plane for impedance matching and heat dissipation, while also serving as a conductive path for signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electromagnetic shielding is added to protect electronic components from EMI, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functions into the solder mask layer: it serves as both the protective solder mask and the EMI shielding layer by integrating an electrically conductive coating directly onto the solder mask. This merging eliminates the need for separate shielding structures, reducing device complexity while maintaining reliability.
Solution Approach 2:
The solder mask is given multiple functions: it provides its traditional protective role and simultaneously serves as the EMI shielding layer through the integrated conductive coating. This multi-functionality approach reduces the overall number of components and simplifies the device structure while ensuring reliable EMI protection.
2Reliability
If a conductive shield layer is added for EMI shielding, then protection from electromagnetic interference is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive coating is integrated directly onto the solder mask layer, combining two manufacturing steps into one. This eliminates the need for separate shielding layer deposition and simplifies the manufacturing process while maintaining effective EMI shielding.
Solution Approach 2:
The conductive coating is applied to the solder mask during the existing solder mask fabrication process, before final assembly. This preliminary integration of the shielding function into an existing manufacturing step avoids adding separate manufacturing complexity while ensuring shielding effectiveness.
3Manufacturing precision
If the conductive coating extends into solder mask openings to contact terminals, then impedance matching is improved, but manufacturing precision requirements increase
Solution Approach 1:
The conductive coating is integrated with the solder mask openings, combining the shielding function with the terminal contact structure. The coating naturally extends into the openings during application, providing both EMI shielding and electrical contact without requiring separate structures, thus reducing device complexity while maintaining impedance matching precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively shields electronic components from EMI, facilitates impedance matching, and enhances heat dissipation, improving the robustness and performance of electronic component packages.
Implementation Method 1
An electrically conductive coating is formed on a solder mask... The conductive coating may be used to shield the electronic component from electromagnetic interference
Implementation Method 2
The conductive coating may be used to shield the electronic component from electromagnetic interference and/or dissipate heat from the electronic component
Data Source
AI summary
An electronic component package includes a substrate having a first surface, an electronic component mounted to the substrate, traces on the first surface, a terminal on the first surface, and a solder mask on the first surface. The solder mask includes a solder mask opening exposing the terminal. An electrically conductive coating and/or conductive coating feature is formed on the solder mask and extends into the solder mask opening to contact and be electrically connected to the terminal. The conductive coating may be grounded to shield the electronic component from electromagnetic interference (EMI). Further, the conductive coating provides a ground plane for the traces facilitating impedance matching of signals on the traces. In addition, the conductive coating has a high thermal conductivity thus enhancing heat dissipation from the electronic component. The conductive coating feature can be used as a conductive path to transmit electrical signals and/or to form circuit patterns that can be used as passive devices.