Heat-Applied Conductive Composite Transfer for Flexible Garments

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Solution Overview

Problem

The application of conductive materials to flexible materials for wearable electronics is limited by inflexible and expensive materials, as well as complex assembly techniques that can lead to fracture and delamination, and often require toxic interlayers or adhesives.

Innovation Solution

A process involving a conductive composite with a resin matrix and conductive filler, applied directly to flexible materials using heat, such as from an iron, which simplifies the assembly and allows for the use of less expensive and safer materials, while maintaining flexibility and reducing the risk of fracture and delamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional conductive materials are used on flexible materials, then conductivity is achieved, but the material becomes inflexible and susceptible to fracture and delamination

Engineering Contradiction:
Improvefracture and delamination resistanceVSAvoidflexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent applies composite materials by combining conductive filler particles (such as metal powders, carbon black, or graphite) with a flexible polymer matrix material. This composite structure allows the conductive composite to maintain electrical conductivity while inheriting the flexibility and elasticity of the polymer matrix, thereby preventing fracture and delamination that would occur with traditional rigid conductive materials.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and chemical parameters of conductive materials by transforming them from rigid metallic forms into composite formulations with controlled particle size, distribution, and concentration within a flexible matrix. This parameter transformation enables the material to maintain conductivity while achieving the desired flexibility and durability for wearable applications.

Inventive Principle:
Principle #35Parameter changes

2Reliability

If complicated assembly techniques are used to apply conductive components, then conductivity is achieved, but the process becomes complex and time-consuming

Engineering Contradiction:
Improveconductive component performanceVSAvoidassembly process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges multiple functions into a single conductive composite material that simultaneously provides conductivity, flexibility, and structural integrity. This eliminates the need for separate conductive components, interlayers, and adhesives, reducing the assembly process to a single step where the composite is applied directly to the flexible substrate through techniques such as screen printing, spray coating, or dip coating.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates unnecessary intermediate layers and complex assembly steps from traditional conductive component applications. By using the conductive composite directly as the functional layer, the patent removes the need for separate adhesive layers, protective interlayers, and complex bonding processes, thereby simplifying the overall assembly procedure.

Inventive Principle:
Principle #2Taking out (Extraction)

3Reliability

If traditional conductive materials are used, then conductivity is achieved, but the cost increases and environmental hazards arise

Engineering Contradiction:
Improveconductive performanceVSAvoidtoxicity and environmental hazard
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent employs cost-effective conductive filler materials such as carbon black, graphite, or common metal powders that are inexpensive and widely available, replacing expensive rare conductive materials. These materials can be applied in thin layers that are sufficient for wearable applications, reducing material costs while maintaining adequate conductivity for the intended use duration.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent converts potentially harmful substances into beneficial conductive composites by using environmentally friendly polymer matrices and non-toxic conductive fillers. The composite formulation transforms individual materials that might have limited utility or environmental concerns into a synergistic combination that achieves superior conductivity while being safe for wearable contact and environmentally sustainable.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the expanded use of wearable electronics for monitoring and information display, simplifies the assembly process, and allows for the direct application of conductive materials to flexible substrates, reducing costs and environmental hazards while enhancing durability.

Implementation Method 1

heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 2

The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to a flexible material

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10201194B2Process of applying a conductive composite, transfer assembly having a conductive composite, and a garment with a conductive composite
Publication Date: 2019.02.12 TE CONNECTIVITY SOLUTIONS GMBH
  • US10201194B2 patent drawing

AI summary

Processes of applying conductive composites on flexible materials, transfer assemblies, and garments including conductive composites are disclosed. The processes include positioning the conductive composite relative to the flexible material, the conductive composite having a resin matrix and conductive filler, and heating the conductive composite with an iron thereby applying the conductive composite directly onto the flexible material. Additionally or alternatively, the processes include positioning the conductive composite relative to the clothing, and heating the conductive composite thereby applying the conductive composite on the clothing. The garments include the flexible material and the conductive composite positioned directly on the flexible material. The transfer assembly has the conductive composite on a transfer substrate. The transfer substrate is capable of permitting heating of the conductive composite through the transfer substrate, the heating being at a temperature that permits applying the conductive composite to the flexible material.