Conductive Composition for Low-Temperature Conductive Image Recording
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Solution Overview
Problem
Existing conductive compositions require high-temperature firing or solvent washing to remove non-conductive modifiers, making it difficult to achieve high conductivity in recorded images, especially with diverse base materials.
Innovation Solution
A conductive composition using a low-molecular weight compound with a hydrazine structure and hydrophilic groups as a treatment agent for metal particles, allowing for stable dispersion and easy removal through simple post-treatment like drying, without the need for high-temperature firing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-temperature firing treatment is performed to remove modifiers from conductive images, then conductivity is improved, but energy consumption increases and base material selection is restricted
Solution Approach 1:
The patent changes the chemical composition parameters of the treatment agent from conventional modifiers to specific low-molecular weight compounds with hydrophilic groups and nitrogen-containing functional groups. This parameter change enables the treatment agent to be removed at low temperatures through simple drying, resolving the contradiction between achieving good conductivity and reducing energy consumption.
Solution Approach 2:
The treatment agent is designed as a temporary component that serves its purpose during the conductive composition formulation and application stages, then can be easily removed through simple drying. This disposable approach eliminates the need for energy-intensive high-temperature firing while still achieving the desired conductivity, thus reducing energy consumption.
2Reliability
If high-temperature firing treatment is performed to remove modifiers, then conductivity is improved, but adaptability to base materials decreases
Solution Approach 1:
The patent modifies the chemical parameters of the treatment agent to include low molecular weight compounds with hydrophilic groups and nitrogen-containing functional groups. These parameter changes enable the treatment agent to be easily removed through simple drying at low temperatures, making the conductive composition compatible with a wide variety of base materials that cannot withstand high-temperature firing.
Solution Approach 2:
The treatment agent with hydrophilic groups and nitrogen-containing functional groups provides universal compatibility across different base materials. The low molecular weight structure and specific functional groups allow the treatment agent to be effectively removed through simple drying regardless of the base material type, thus enhancing adaptability while maintaining conductivity.
3Stability of the object's composition
If conventional modifiers are used to disperse metal particles, then dispersion stability is improved, but conductivity deteriorates due to presence of non-conductive components
Solution Approach 1:
The patent changes the molecular weight parameter of the treatment agent to low molecular weight compounds, and modifies the functional groups to include hydrophilic groups and nitrogen-containing groups. These parameter changes enable the treatment agent to provide adequate dispersion stability while being easily removable through simple drying, thus preventing conductivity deterioration from residual non-conductive components.
Solution Approach 2:
The treatment agent is designed as a temporary dispersant that performs its function during application but can be easily removed through simple drying. This disposable approach ensures that non-conductive components do not remain in the final conductive image, maintaining high conductivity while providing necessary dispersion stability during the process.
4Use of energy by stationary object
If simple drying post-treatment is used instead of high-temperature firing, then energy consumption decreases, but removal of non-conductive modifiers becomes insufficient
Solution Approach 1:
The patent changes the chemical parameters of the treatment agent to low molecular weight compounds with hydrophilic groups and nitrogen-containing functional groups. These parameter changes reduce the binding strength between the treatment agent and metal particles, enabling effective removal through simple drying at low temperatures. This resolves the contradiction by allowing sufficient modifier removal with minimal energy input while maintaining conductivity.
Solution Approach 2:
The treatment agent is designed as a temporary component that can be easily removed through simple drying without requiring high energy input. The low molecular weight structure and specific functional groups ensure that the treatment agent does not strongly bind to the metal particles, allowing for effective removal through low-energy drying processes while maintaining the conductivity of the final product.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the recording of conductive images with excellent conductivity using only simple post-treatment like drying, without the need for high-temperature firing, suitable for various base materials.
Implementation Method 1
a treatment agent for coating the metal particle... a low-molecular weight compound having a hydrazine structure and a hydrophilic group
Implementation Method 2
at least one of R1 to R4 represents a hydrophilic group... which has a hydrazine structure and a hydrophilic group
Data Source
AI summary
The conductive composition includes: a metal particle; and a treatment agent for coating the metal particle. The treatment agent is at least one kind selected from the group consisting of: a compound represented by the general formula (1); a compound represented by the general formula (2); a compound represented by the general formula (3); a compound represented by the general formula (4); a compound represented by the general formula (5); a compound represented by the general formula (6); and a compound represented by the general formula (7). The method of producing the conductive composition includes: a first step of reducing a metal salt in an aqueous medium to form the metal particle; and a second step of bringing the formed metal particle into contact with the treatment agent.