Conductive Connectors in Multichip Modules
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Solution Overview
Problem
Multichip modules face challenges in efficiently and cost-effectively connecting semiconductor devices due to the need for additional bond wires and complex lead shapes, which occupy space and increase costs.
Innovation Solution
Conductive connectors formed as part of the substrate, such as a lead frame, provide low resistance electrical connections between devices without additional bond wires or complex lead shapes, using a half-etch process to create layers with varying thicknesses for efficient packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bond or ribbon bond connections are used to connect semiconductor devices to leads, then electrical connections are established, but the package requires a large system board area and complex lead shapes
Solution Approach 1:
The patent merges the lead frame structure with integrated conductive connectors that directly connect semiconductor devices to each other. Instead of separate leads extending to the board, the connectors are formed within the lead frame substrate itself, eliminating the need for external wire bonds and reducing the required board area.
Solution Approach 2:
The patent transitions from a two-dimensional layout where devices must be spaced apart for wire bonds to a three-dimensional structure where conductive connectors are embedded within the lead frame substrate. This allows connections to be made beneath and within the device areas, effectively utilizing vertical space to reduce footprint.
2Reliability
If additional bond wires are used to connect devices, then electrical connections are established, but costs increase and space is occupied
Solution Approach 1:
The patent combines the functions of the lead frame and connection elements into a single integrated structure. The conductive connectors are formed as part of the lead frame substrate through etching and plating processes, eliminating the need for separate bond wires and reducing overall package complexity.
Solution Approach 2:
The patent extracts the connection function from separate external elements (bond wires) and integrates it directly into the lead frame structure. The conductive connectors are formed by etching conductive paths and applying conductive material within the lead frame, removing the need for additional bonding components.
3Adaptability or versatility
If complex lead shapes are used to accommodate connections, then all connections can be made, but manufacturing complexity and costs increase
Solution Approach 1:
The patent performs preliminary actions by pre-forming the conductive connector structures within the lead frame during the lead frame manufacturing process itself. The etching and plating of conductive paths are completed before device attachment, simplifying subsequent assembly steps and reducing manufacturing complexity.
Solution Approach 2:
The patent creates a universal lead frame structure that serves multiple functions: providing mechanical support, establishing electrical connections through integrated connectors, and enabling various device configurations. The standardized conductive connector design can accommodate different device types and connection patterns without requiring custom lead shapes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables space-efficient and cost-effective electrical connections between semiconductor devices within multichip modules, reducing the need for additional bonding and complex lead frames, while maintaining thermal and electrical functionality.
Implementation Method 1
A first layer of conductive material having a first thickness less than substrate thickness, the first layer including the device mounting surface, the substrate also has a second layer of the conductive material having a second thickness less than the substrate thickness
Data Source
AI summary
In a described example, a packaged device includes a substrate having a device mounting surface including a first layer of conductive material having a first thickness less than a substrate thickness, the substrate having a second layer of the conductive material having a second thickness less than the substrate thickness. A first semiconductor device is mounted to a first area of the device mounting surface; and a second semiconductor device is mounted to a second area on the device mounting surface and spaced from the first semiconductor device. At least two connectors are formed of the first layer of the substrate having first ends coupled to one of first bond pads on the first semiconductor device and the at least two connectors having second ends coupled to one of second bond pads on the second semiconductor device.