Conductive Convex Electrode Structure for Micro LED Bonding
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Solution Overview
Problem
Micro LED technology faces challenges in transfer and bonding methods, including high costs with anisotropic conductive adhesives, performance degradation with solder paste, pressure-induced damage to thin film transistors, and adhesive issues with metal-to-metal contact.
Innovation Solution
A display substrate with conductive convexes is designed, featuring a negatively correlated dimension and distance ratio, composed of dielectric and conductive materials, and arranged in arrays to facilitate efficient micro LED bonding, reducing manufacturing costs and improving transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If anisotropic conductive adhesives are used for micro LED bonding, then bonding reliability is improved, but manufacturing cost increases
Solution Approach 1:
The patent introduces a conductive convex structure as an intermediary element between the electrode and micro LED. This convex structure with conductive material fills the space and provides reliable electrical connection without requiring expensive anisotropic conductive adhesives, thus maintaining bonding reliability while reducing manufacturing cost
Solution Approach 2:
The conductive convex structure uses cost-effective conductive materials (such as conductive paste or metal layers) instead of expensive anisotropic conductive adhesives. The convex geometry itself provides the bonding function, eliminating the need for specialized adhesive materials
2Ease of manufacture
If solder paste is used for micro LED bonding, then manufacturing cost is reduced, but performance degradation occurs
Solution Approach 1:
The patent applies conductive material selectively in the convex region rather than using solder paste across the entire bonding area. The conductive convex structure concentrates the electrical connection function in a specific localized geometry, providing reliable performance while using cost-effective materials
3Strength
If pressure is applied during bonding, then bonding strength is improved, but thin film transistors are damaged
Solution Approach 1:
The conductive convex structure uses a curved or rounded geometry that distributes bonding pressure more evenly across the contact area. This curved surface design reduces stress concentration and prevents damage to thin film transistors while still achieving strong bonding through the distributed contact
4Ease of manufacture
If metal-to-metal contact is used, then manufacturing cost is reduced, but adhesive issues arise
Solution Approach 1:
The conductive convex structure acts as an intermediary between metal electrodes, providing a geometry that facilitates reliable contact. The convex shape increases contact area and improves adhesion through mechanical interlocking, eliminating adhesive issues while maintaining cost-effectiveness
Data Source
AI summary
The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.