Conductive Convex Electrode Structure for Micro LED Bonding Yield
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Solution Overview
Problem
Micro LED technology faces challenges in transfer and bonding methods that can degrade performance, increase costs, or adversely affect electronic elements, particularly in the context of micro LED display substrates.
Innovation Solution
A display substrate design featuring conductive convexes with a specific cross-sectional dimension correlation to the electrode distance and composed of dielectric and conductive materials, integrated with an inorganic material layer, facilitates easy connection and improves transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional transfer and bonding methods are used for micro LED, then the micro LED can be mounted on the display substrate, but the performance of micro LED degrades and manufacturing costs increase
Solution Approach 1:
The conductive convex is divided into multiple portions (first portion made of dielectric material, second portion made of conductive material) with different material compositions and functions. This segmentation allows each portion to be optimized for its specific role: the dielectric portion provides mechanical support and insulation, while the conductive portion ensures electrical connection, thereby improving micro LED performance without increasing manufacturing complexity
Solution Approach 2:
Different regions of the conductive convex are assigned different material properties. The first portion uses dielectric material for mechanical stability and insulation, while the second portion uses conductive material for electrical connection. This local differentiation of material quality enables the structure to simultaneously achieve mechanical support and electrical conductivity, improving bonding yield and performance
2Productivity
If conventional bonding methods are used, then micro LED can be connected to the substrate, but bonding yield is reduced and electronic elements are adversely affected
Solution Approach 1:
The conductive convex acts as an intermediary structure between the micro LED and the substrate. Its multi-port ion structure with dielectric and conductive materials provides a optimized interface that facilitates reliable bonding while protecting sensitive electronic elements from damage during the bonding process, thereby improving bonding yield
Solution Approach 2:
The conductive convex is constructed from composite materials including both dielectric material (first portion) and conductive material (second portion). This composite structure combines the advantages of different materials: the dielectric portion provides mechanical support and insulation to protect electronic elements, while the conductive portion ensures reliable electrical connection, thereby improving bonding yield without damaging electronic elements
3Reliability
If simple conductive structures are used, then manufacturing is easier, but electrical contact and mechanical stability are insufficient
Solution Approach 1:
The conductive convex is segmented into functionally distinct portions: a first portion made of dielectric material for mechanical support and insulation, and a second portion made of conductive material for electrical connection. This segmentation enables each portion to be optimized for its specific function, achieving reliable electrical contact and mechanical stability
Solution Approach 2:
The conductive convex structure serves multiple functions simultaneously: the dielectric first portion provides mechanical support and electrical insulation, while the conductive second portion provides electrical connection. This multi-functionality is achieved within a single integrated structure, balancing reliability with manageable complexity
Data Source
Figure 1a~3
Figure 4~6
Figure 7a~7c
AI summary
The present disclosure relates to a display substrate and a method for manufacturing the same. The display substrate includes: a substrate; a first electrode located on the substrate; and a conductive convex located on the first electrode. A dimension of a cross section of the conductive convex along a plane parallel to the substrate is negatively correlated to a distance from the cross section to a surface of the first electrode.