Conductive Structure for Touch Panels with Copper-Nickel Diffusion Barrier
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Solution Overview
Problem
Large-area touch screen panels face issues with visibility due to high reflectivity and glare from metal electrodes, and existing solutions are costly and complex, with ITO thin films having high sheet resistance leading to RC delays and requiring additional compensation chips.
Innovation Solution
A conductive structure body comprising a copper metal layer, a discoloration preventing layer with 50-80% nickel content, and a light reflection reducing layer including copper oxide or nitride, which prevents copper diffusion and reduces light reflectivity, enhancing thermal stability and visibility while allowing for a single etching process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal layer including copper is used in large-area touch screen panels, then electrical conductivity is improved, but light reflectivity increases causing glare and poor visibility
Solution Approach 1:
A discoloration preventing layer comprising copper and nickel is introduced as an intermediary between the copper metal layer and the light reflection reducing layer. This intermediate layer prevents copper diffusion to the light reflection reducing layer while maintaining electrical conductivity and enabling effective glare reduction.
Solution Approach 2:
The patent employs a composite multi-layer structure combining copper metal layer, copper-nickel discoloration preventing layer, and light reflection reducing layer (copper oxide, copper nitride, or aluminum oxide). This composite structure simultaneously achieves high electrical conductivity, thermal stability, and reduced light reflectivity.
2Object-affected harmful factors
If existing solutions are used to reduce light reflectivity, then visibility is improved, but manufacturing cost increases and process complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated structure: the discoloration preventing layer simultaneously prevents copper diffusion, maintains electrical conductivity, and enables the light reflection reducing layer to function effectively. This merged approach eliminates the need for separate compensation chips and complex multi-step processes.
Solution Approach 2:
The patent optimizes the nickel content parameter in the discoloration preventing layer to be 50-80 at%, which provides the optimal balance between preventing copper diffusion and maintaining etchability. This parameter optimization enables a single etching process to pattern both the metal layer and discoloration preventing layer, reducing manufacturing complexity.
3Object-affected harmful factors
If existing solutions are used to reduce light reflectivity, then visibility is improved, but device complexity increases due to additional compensation chips
Solution Approach 1:
The patent extracts and eliminates the need for separate compensation chips by integrating the light reflection reduction function directly into the conductive structure through the light reflection reducing layer. This removes the additional external components and simplifies the overall device structure.
4Ease of manufacture
If copper diffusion is not prevented, then manufacturing process is simplified, but thermal stability deteriorates and light reflection reducing layer performance decreases
Solution Approach 1:
The discoloration preventing layer acts as a diffusion barrier intermediary that blocks copper atoms from migrating into the light reflection reducing layer during thermal processing, thereby maintaining thermal stability and preventing degradation of the light reflection reducing layer's optical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes light reflectivity and glare, maintains electrical conductivity, and reduces manufacturing costs by enabling a single etching process, improving visibility and thermal stability in display devices.
Implementation Method 1
a light reflection reducing layer provided on the discoloration preventing layer and including at least one of copper oxide, copper nitride, copper oxynitride, aluminum oxide, aluminum nitride, and aluminum oxynitride
Implementation Method 2
effectively preventing a glare effect of a metal layer
Implementation Method 3
a discoloration preventing layer provided on the metal layer and including copper and nickel... which prevents copper diffusion
Data Source
AI summary
The present specification relates to a conductive structure body, a manufacturing method thereof, a touch panel including the same, and a display device including the same.