Conductive Cover Vertical Claw Substrate Notch Mounting

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

In semiconductor storage devices, the existing methods for attaching a conductive cover to a substrate often result in a limited mountable region due to the requirement for notched portions and claw structures, which restrict the placement of components and mechanical strength, especially when adhering to form factor standards like M.2-2230.

Innovation Solution

The semiconductor storage device incorporates vertical claw portions on the conductive cover and corresponding notched portions on the substrate, allowing for a reduced notch width and increased mountable region by optimizing the attachment mechanism, ensuring precise alignment and secure fixation without compromising mechanical strength.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If traditional attachment methods with notched portions and claw structures are used, then secure fixation is achieved, but the mountable region is limited

Engineering Contradiction:
Improvemountable regionVSAvoidfixation security
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The conductive cover is divided into multiple side plate portions (first, second, third, fourth side plate portions) with individual claw portions at each corner. This segmentation allows each claw to independently engage with corresponding notches on the substrate, distributing the fixation load and maintaining secure attachment while reducing the overall notch width requirements.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The claw portions extend in the thickness direction (vertical dimension) of the substrate, transitioning from a two-dimensional planar attachment to a three-dimensional engagement. This vertical extension allows the claws to hook over the substrate edges and engage notches from above, providing secure fixation with minimal lateral notch width.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of stationary object

If notch width is reduced to expand mountable area, then more components can be mounted, but attachment security may be compromised

Engineering Contradiction:
Improvemountable areaVSAvoidattachment strength
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

The attachment strength is enhanced by utilizing the thickness direction dimension. The claw portions extend vertically and hook over the substrate edges, creating a mechanical interlock that compensates for the reduced lateral notch width. This three-dimensional engagement maintains attachment strength despite smaller two-dimensional notch dimensions.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The claw portions are designed with asymmetric geometry where the width at the top (engagement side) is smaller than the width at the bottom (attachment side). This asymmetric design allows the narrow top portion to fit into reduced-width notches while the wider bottom portion maintains structural integrity and attachment strength to the conductive cover.

Inventive Principle:
Principle #4Asymmetry

3Manufacturing precision

If claw portions extend from side plates, then precise alignment is achieved, but device complexity increases

Engineering Contradiction:
Improvealignment precisionVSAvoidstructure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The claw portions are integrated directly into the side plate portions of the conductive cover as a unified structure, eliminating the need for separate alignment components or additional assembly steps. This merging of functions reduces overall device complexity while maintaining precise alignment capability through the geometric relationship between the claws and notches.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11622454B2Semiconductor storage device
Publication Date: 2023.04.04 KIOXIA CORP
  • US11622454B2 patent drawing
  • US11622454B2 patent drawing
  • US11622454B2 patent drawing

AI summary

According to one embodiment, in a semiconductor storage device, a conductive cover is provided on a side of the principal surface, and covers at least a part of the memory and the controller. A substrate has a first notched portion and a second notched portion in an outer edge. The conductive cover has a top plate portion, a first side plate portion, a second side plate portion, a first claw portion, and a second claw portion. The first claw portion is extended from a lower end of the first side plate in a direction intersecting with the principal surface. The first claw portion is fitted into the first notched portion. The second claw portion is extended from a lower end of the second side plate in the direction intersecting with the principal surface. The second claw portion is fitted into the second notched portion.