Conductive Dam Encapsulation for Hearing Device Shielding
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Solution Overview
Problem
Existing methods for encapsulating electronic components on substrates, such as printed circuit boards, face challenges in providing effective electromagnetic shielding and maintaining material uniformity, especially when using jetting technology.
Innovation Solution
The method involves creating a dam around the electronic components using an electrically conducting material, filling it with a liquid encapsulation material that solidifies, and applying a conductive cover material on the solidified surface, thereby providing electromagnetic shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If jetting technology is used to apply encapsulation material, then productivity is improved, but manufacturing precision deteriorates due to difficulty in controlling material uniformity
Solution Approach 1:
A dam structure is introduced as an intermediary element between the jetting device and the encapsulation area. The dam confines the jetted encapsulation material within a defined boundary, preventing material from spreading uncontrollably and ensuring uniform distribution around the electronic components. This mediator structure enables the use of high-speed jetting technology while maintaining precise material placement and uniformity.
2Object-affected harmful factors
If encapsulation material is applied to shield electronic components, then electromagnetic shielding is improved, but device complexity increases due to additional materials and processes
Solution Approach 1:
The encapsulation material serves multiple functions simultaneously: it provides electromagnetic shielding for the electronic components, acts as a moisture barrier, and serves as a structural confining element within the dam. By combining these functions into a single material layer, the solution reduces overall device complexity while maintaining effective shielding performance.
3Manufacturing precision
If a dam structure is added to control material flow, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The dam structure is constructed in advance before the encapsulation material is applied. This preliminary action creates a pre-defined containment boundary that guides the material placement process. By preparing the dam structure beforehand, the system achieves precise material placement without requiring complex real-time control mechanisms during the jetting process, thereby limiting the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively encapsulates and electromagnetically shields the electronic components, reducing electromagnetic interference and improving the reliability of electronic devices, such as hearing aids, by preventing noise and moisture ingress.
Implementation Method 1
The fill encapsulation material is configured to solidify
Implementation Method 2
The dam material comprises an electrically conducting material... The cover material comprises an electrically conducting material... the one or more electronic components are encapsulated and electromagnetically shielded
Data Source
AI summary
Disclosed is a system, a hearing device and a method for encapsulating one or more electronic components on a substrate. The method comprises providing a dam on the substrate, the dam is provided around the one or more electronic components, the dam comprises a dam material comprising an electrically conducting material. The method comprises providing a liquid fill encapsulation material within the dam on the substrate, the fill encapsulation material encapsulates the one or more electronic components, the fill encapsulation material is configured to solidify, the solidified fill encapsulating material comprises a first surface exposed to surroundings. The method comprises applying a cover material on the first surface of the solidified fill encapsulation material, the cover material comprising an electrically conducting material, whereby the one or more electronic components are encapsulated and electromagnetically shielded.