Conductive Die Carrier for Multi-Chip Semiconductor Package Thermal Management
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Solution Overview
Problem
Existing semiconductor power packages have limitations in thermal conductivity, are expensive due to ceramic components, and can only house a single semiconductor die, leading to reduced heat transfer and increased footprint for multiple die applications.
Innovation Solution
A packaged semiconductor device using a thermally and electrically conductive die carrier with high thermal conductivity materials like Cu, CuMo, AlSiC, or Ag-diamond, combined with a high-temperature die attach process and leadframe integration, allowing for multiple semiconductor dies in a single package with improved thermal management and reduced size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If ceramic components are used in power packages, then thermal conductivity is improved, but manufacturing cost increases
Solution Approach 1:
The patent replaces expensive ceramic materials with cost-effective metal substrates (such as aluminum or copper) that can be manufactured using conventional PCB-like processes. This substitution maintains adequate thermal conductivity while dramatically reducing material and manufacturing costs, making the package more economically viable for mass production.
Solution Approach 2:
The patent employs composite structures combining metal substrates with thermal interface materials and heat sink integrations. This composite approach achieves thermal performance comparable to ceramic packages while utilizing cheaper, more manufacturable materials and processes.
2Device complexity
If a single semiconductor die is housed per package, then manufacturing simplicity is maintained, but device functionality is limited
Solution Approach 1:
The patent designs a universal package substrate that can accommodate multiple semiconductor dies of different types and sizes. The substrate includes multiple die attach locations, varied interconnect configurations, and flexible thermal management structures, enabling a single package design to serve multiple device functions and applications.
Solution Approach 2:
The package substrate is divided into multiple independent die attach regions, each capable of hosting separate semiconductor dies. This segmentation allows different dies (power devices, control circuits, signal processing components) to be independently mounted and interconnected on the same package, enhancing functionality while maintaining manufacturing simplicity.
3Area of stationary object
If multiple semiconductor dies are packaged in a single package, then footprint is reduced, but thermal management complexity increases
Solution Approach 1:
The patent integrates multiple thermal management functions into a single unified heat sink structure that serves all semiconductor dies simultaneously. The heat sink is thermally coupled to the substrate through multiple thermal vias and conductive paths, consolidating what would otherwise be separate thermal management systems into one coordinated structure, thereby reducing overall complexity.
Solution Approach 2:
The package substrate acts as an intermediary thermal management platform, distributing heat from multiple dies through integrated thermal vias and conductive layers to a common heat sink. This intermediary structure simplifies thermal management by providing a centralized heat distribution network rather than requiring individual thermal paths for each die.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal conductivity, reduces costs by eliminating ceramic components, and enables packaging multiple high-power semiconductor dies in a single package, improving reliability and performance for high-power applications.
Implementation Method 1
The die attach material has a melting point in excess of 240° C. and improves thermal conductivity
Implementation Method 2
a thermally and electrically conductive die carrier with high thermal conductivity materials like Cu, CuMo, AlSiC, or Ag-diamond
Data Source
AI summary
A packaged semiconductor device may include a leadframe and a die carrier mounted to the leadframe. The die carrier is formed from an electrically and thermally conductive material. A die is mounted to a surface of the die carrier with die attach material having a melting point in excess of 240° C. A method may include providing the die carrier, melting the die attach material at a temperature in excess of 240° C. to attach the die to the surface of the die carrier to form a sub-assembly, attaching the sub-assembly to a leadframe, electrically interconnecting the die and the leadframe, and enclosing at least portions of the die and the leadframe to form a packaged device.