Conductive Dividing Wall for Organic EL Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional organic EL devices face issues with disconnection of the upper electrode due to insulating organic resin dividing walls, adhesion problems, difficulty in forming thick photoresist films, and high costs, which affect the reliability and definition of the display.
Innovation Solution
A conductive dividing wall is formed by electroplating between adjacent lower electrodes, ensuring electrical connection with the upper electrode, improving adhesion, and allowing for thicker and more flexible designs, thus preventing disconnection and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an organic resin material is used for the dividing wall, then the dividing wall can be formed by spin coating and photolithography, but the upper electrode may disconnect because the organic resin material is an insulator
Solution Approach 1:
The dividing wall is constructed as a composite structure with a first dividing wall made of organic resin material and a second dividing wall made of conductive material. This composite structure combines the ease of formation of organic resin with the electrical conductivity of conductive materials, resolving the contradiction between ease of manufacture and electrical connection reliability.
2Ease of manufacture
If an organic resin material is used for the dividing wall, then the dividing wall can be formed by spin coating, but the adhesion to the base is low and the dividing wall may come off
Solution Approach 1:
The dividing wall uses a composite structure where the organic resin first dividing wall provides ease of formation while the conductive second dividing wall enhances adhesion and mechanical strength, preventing the dividing wall from coming off.
3Length of stationary object
If a thick photoresist film is formed by spin coating, then the dividing wall height can be increased, but it is difficult to form a thick photoresist film with sufficient adhesion
Solution Approach 1:
Instead of increasing photoresist thickness in a single dimension, the solution adds a vertical layering dimension by forming a two-layer structure with organic resin and conductive materials, achieving both height and adhesion through layered construction rather than thickening a single layer.
4Reliability
If conventional materials and methods are used, then the production cost is high, but the definition and reliability of the display are compromised
Solution Approach 1:
The invention changes the material composition parameter of the dividing wall from single-material organic resin to a two-material composite structure, improving reliability while using cost-effective materials and processes that are already established in the field.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of organic EL devices by preventing upper electrode disconnection, improving adhesion, and enabling higher definition and flexibility, while reducing production costs.
Implementation Method 1
A conductive dividing wall is formed by electroplating between adjacent lower electrodes
Data Source
AI summary
An organic EL device (1) includes: a substrate (11); a plurality of lower electrodes (14) formed on the substrate (11) and corresponding to luminescence regions, respectively; a dividing wall (17) formed so as to surround the luminescence regions; light-emitting layers (19) formed on the lower electrodes (14) in the luminescence regions, respectively; and an upper electrode (20) formed on the dividing wall (17) and the light-emitting layers (19). The dividing wall (17) is conductive and electrically connected to the upper electrode (20).


