Conductive Edge Projections for Direct PCB Interconnect

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Solution Overview

Problem

Existing methods for interconnecting printed circuit substrates require mechanical connectors or cables, which increase the physical size and manufacturing complexity of substrate assemblies, and are costly.

Innovation Solution

The use of conductive projections on the edges of printed circuit substrates that extend transverse to their surfaces, allowing for direct electrical contact and eliminating the need for mechanical connectors or cables, enabling a more compact and cost-effective assembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If mechanical connectors or cables are used to interconnect printed circuit substrates, then reliable electrical connection is achieved, but the physical size of the substrate assembly increases and manufacturing complexity increases

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidsubstrate assembly physical size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent merges the electrical connection function directly into the substrate structure by forming conductive projections (such as castellated edges) on the substrate itself. This eliminates the need for separate mechanical connectors or cables, thereby reducing the overall assembly size while maintaining reliable electrical connections between substrates.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the electrical connection function from external connectors and integrates it directly into the substrate structure. By removing the separate connector component and embedding conductive elements within the substrate edges, the design achieves compact size without sacrificing connection reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If mechanical connectors or cables are used to interconnect printed circuit substrates, then electrical connection is established, but the number of manufacturing steps increases and production cost increases

Engineering Contradiction:

Improveelectrical connectionVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the substrate manufacturing process with the electrical connection formation process. By integrating conductive projections directly into the substrate structure during manufacturing, the design eliminates separate connector assembly steps, thereby reducing manufacturing complexity and production costs while ensuring reliable electrical connections.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The substrate structure itself provides the electrical connection function through its integrated conductive projections. This self-service approach eliminates the need for external connectors and simplifies the manufacturing process by reducing the number of components that need to be assembled and tested.

Inventive Principle:

Principle #25Self-service

3Reliability

If mechanical connectors or cables are used to connect printed circuit substrates, then electrical interface is established, but the overall manufacturing cost increases

Engineering Contradiction:

Improveelectrical interfaceVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent merges the electrical interface function into the substrate structure itself through conductive projections. This integration eliminates the need for separate connector components, reducing material costs and assembly costs while maintaining reliable electrical interfaces between substrates.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts the electrical interface function from external connectors and embeds it directly into the substrate. This removal of separate connector components reduces the bill of materials and simplifies assembly operations, thereby lowering overall manufacturing costs while preserving electrical interface reliability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the size and manufacturing complexity of substrate assemblies by allowing for direct electrical contact between substrates, simplifying the assembly process and lowering costs by avoiding the use of mechanical connectors and cables.

Implementation Method 1

The projection comprises conductive material... The projection bottom surface of the first PC substrate overlaps and is in contact with the projection top surface of the second PC substrate

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS11224126B2Edge interconnects for use with circuit boards and integrated circuits

Publication Date: 2022.01.11 SCI APPL INT CORP

AI summary

A substrate assembly includes at least one printed circuit (PC) substrate. Each PC substrate includes a PC top surface and a PC bottom surface spaced from each other and an edge that runs at least partially about a periphery of the PC substrate between the PC top surface and the PC bottom surface. The edge includes or defines on a facet or edge surface of the edge at least one projection that extends transverse or normal to the facet or edge surface. The projection includes a projection top surface and a projection bottom surface spaced from each other and the projection can include or be made of conductive material.