Transparent Conductive Electrode Bonding with Adhesive Intermediate Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for connecting transparent conductive electrodes to external circuits, such as anisotropic conductive films and conductive adhesives, face reliability issues under high temperature and humidity conditions, leading to delamination and cracking, which compromises electrical connectivity in miniaturized electronic devices like mobile phones and projectors.
Innovation Solution
A conductive electrode with an adhesive intermediate layer, typically made of chromium or titanium, and a metal layer formed by precious metals like gold or platinum, is used to enhance bonding strength and reliability, ensuring stable electrical connection without affecting the conductive performance of the transparent conductive film.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional connection methods (ACF or conductive adhesive) are used to connect transparent conductive electrodes to external circuits, then the device structure is simple and easy to manufacture, but the connection reliability deteriorates under high temperature and humidity conditions, leading to delamination and cracking
Solution Approach 1:
The patent applies composite materials by creating a multi-layer conductive electrode structure consisting of a transparent conductive film layer, an adhesive intermediate layer, and a metal layer. This composite structure combines the advantages of each material: the transparent conductive film provides electrical conductivity and transparency, the adhesive intermediate layer provides strong bonding to the substrate, and the metal layer provides excellent electrical connectivity and environmental stability, thereby resolving the contradiction between ease of manufacture and connection reliability
Solution Approach 2:
The patent introduces an adhesive intermediate layer as a mediator between the transparent conductive film and the external circuit substrate. This intermediate layer specifically addresses the adhesion problem by providing strong chemical bonding to both the transparent conductive film and the substrate, preventing delamination and cracking under harsh environmental conditions while maintaining the simplicity of the manufacturing process
2Device complexity
If the transparent conductive film is directly connected to the external circuit, then the manufacturing process is simple, but the bonding strength is insufficient, causing delamination and interface cracking under temperature cycling and high temperature high humidity environments
Solution Approach 1:
The patent transforms the simple direct connection structure into a composite multi-layer structure. By adding the adhesive intermediate layer and metal layer, the bonding strength is significantly enhanced while the transparent conductive film's electrical and optical properties are preserved. The composite structure ensures strong adhesion under temperature cycling and high temperature high humidity environments
Solution Approach 2:
The patent segments the connection structure into distinct functional layers: the transparent conductive film layer for electrical conductivity, the adhesive intermediate layer for bonding, and the metal layer for electrical connectivity. This segmentation allows each layer to optimize its specific function, with the adhesive intermediate layer specifically designed to provide strong bonding strength without affecting the overall device complexity
3Ease of operation
If ACF is used for electrical connection, then the connection process is simple, but environmental reliability deteriorates with poor adhesion and susceptibility to delamination and interface cracking
Solution Approach 1:
The patent replaces the single-material ACF connection method with a composite multi-layer conductive electrode structure. The adhesive intermediate layer provides superior adhesion properties, the metal layer provides environmental stability and electrical connectivity, and the transparent conductive film maintains electrical conductivity. This composite approach significantly improves environmental reliability while maintaining ease of operation through a streamlined manufacturing process
4Reliability
If bonding methods are used to connect transparent conductive film to external circuits, then electrical connectivity is achieved, but connection reliability is limited and operation space is constrained
Solution Approach 1:
The patent uses composite materials to achieve both high connection reliability and maintained simplicity. The multi-layer structure of transparent conductive film, adhesive intermediate layer, and metal layer provides superior electrical connectivity and environmental reliability while the integrated design keeps the overall device complexity manageable through a unified manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves the bonding strength between the conductive electrode and the external circuit, enhancing reliability and stability, and reduces the risk of delamination, thereby achieving effective and reliable electrical interconnection in harsh environments.
Implementation Method 1
an adhesive intermediate layer disposed on the transparent conductive film
Implementation Method 2
a metal layer disposed on the adhesive intermediate layer and configured to be connected to an external circuit
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
This application relates to the field of conductive electrode and electronic device technologies, and in particular, to a conductive electrode, a preparation method thereof, and an electronic device. The conductive electrode includes: a transparent conductive film disposed on a substrate; an adhesive intermediate layer disposed on the transparent conductive film; and a metal layer disposed on the adhesive intermediate layer, where the metal layer is mainly formed by a precious metal and configured to be bonded to an external circuit. This application can improve bonding strength between the transparent conductive electrode and an external circuit and meet requirements for electrical connectivity and connection reliability.