Conductive Encapsulant EMI Shielding for Semiconductor Packages

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Solution Overview

Problem

The increasing complexity and smaller sizes of semiconductor devices lead to higher levels of electromagnetic interference (EMI) due to increased electromagnetic radiation, which can adversely affect neighboring devices.

Innovation Solution

A package device with a supporting member, main component, sealant, and conductive encapsulant is developed, featuring grounding contacts and conductive particles. The conductive encapsulant creates an electrical pathway for grounding undesired electromagnetic radiation when a grounding voltage is applied, providing EMI shielding.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If semiconductor devices are made smaller and more densely packed to increase processing speed, then device density and processing speed are improved, but electromagnetic interference between neighboring devices increases

Engineering Contradiction:

Improveprocessing speedVSAvoidelectromagnetic interference

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent converts the harmful electromagnetic radiation into a beneficial effect by using the conducted electromagnetic interference (CEMI) signal generated by neighboring devices as a feedback input. This CEMI signal is processed through a filter and amplifier to generate a compensating signal that is injected back into the affected device, thereby canceling out the harmful EMI effects and improving signal integrity in high-density configurations

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent implements a feedback mechanism where the CEMI signal from neighboring devices is continuously monitored, processed, and used to generate compensating signals. The feedback loop includes sensing the EMI environment, filtering the unwanted signals, amplifying the compensated signal, and injecting it back into the affected device to dynamically counteract electromagnetic interference in real-time

Inventive Principle:

Principle #23Feedback

2Speed

If higher clock speeds are used to enhance processing speeds, then processing performance is improved, but electromagnetic radiation and EMI levels increase

Engineering Contradiction:

Improveprocessing speedVSAvoidelectromagnetic radiation

Core Design Contradiction:

SpeedVSObject-generated harmful factors

Solution Approach 1:

The patent converts the harmful electromagnetic radiation generated by high-speed clock operations into a useful feedback signal. The CEMI generated by the high-speed device is captured, processed, and used to generate compensating signals that cancel out the radiation effects, allowing high clock speeds to be maintained without proportionally increasing EMI harm

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Area of stationary object

If greater density of semiconductor devices is implemented, then space utilization is improved, but level of undesired electromagnetic radiation at neighboring devices increases

Engineering Contradiction:

Improvedevice densityVSAvoidundesired electromagnetic radiation

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The patent implements a feedback-based EMI compensation system that is particularly effective in high-density configurations. Each device monitors the CEMI signals from its neighbors, processes these signals through filtering and amplification, and injects compensating signals to cancel out the interference, enabling dense packing without proportional increases in harmful radiation effects

Inventive Principle:

Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces EMI by establishing an electrical pathway for grounding electromagnetic radiation, thereby protecting semiconductor devices from interference.

Implementation Method 1

The conductive encapsulant creates an electrical pathway for grounding undesired electromagnetic radiation when a grounding voltage is applied

Methodology Applied

Scientific EffectElectrical Conduction: Conduction (electrical)

Data Source

PatentUS11264334B2Package device and method of manufacturing the same

Publication Date: 2022.03.01 NAN YA TECH

AI summary

The present disclosure provides a package device and a method of manufacturing the same. The package device includes a supporting member, a main component, a sealant, and a conductive encapsulant. The supporting member includes a plurality of grounding contacts. The main component is mounted on the supporting member. The sealant covers the main component. The conductive encapsulant encases the sealant and the grounding contacts exposed through the sealant for EMI shielding.