Conductive 2K Epoxy Adhesive Sheet for Voltage-Triggered Debonding
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Solution Overview
Problem
Existing adhesive systems are difficult to disassemble without damaging the substrates, especially when electrical potential is applied, which is necessary for debonding, and they do not integrate well with conventional structural adhesives for composite structures.
Innovation Solution
An adhesive sheet comprising a first and second electrically conductive foil with a conductive and debondable 2K epoxy adhesive composition, containing an electrolyte, is used between the foils, allowing debonding by applying a voltage across the foils.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional structural adhesives are used for bonding composite structures, then strong bonding strength is achieved, but the bonded structures become difficult to disassemble without damaging substrates
Solution Approach 1:
The adhesive system is segmented into two distinct parts: a conventional structural adhesive component and a debonding agent component. This segmentation allows the adhesive to provide strong bonding when combined, while enabling selective activation of the debonding function through controlled application of the second component or electrical stimulus, thus resolving the contradiction between bond strength and disassembly ease.
Solution Approach 2:
The adhesive system transitions from a static, permanently bonded state to a dynamic, controllable bonding state. By incorporating electroactive polymers or stimuli-responsive materials, the adhesive bonds can be dynamically activated or deactivated through electrical fields, allowing the structure to switch between bonded and debonded states as needed, thereby maintaining both strong bonding and ease of repair.
2Ease of repair
If mechanical processes like sand blasting or wire brushing are used to remove adhesive, then adhesive removal is achieved, but substrate surfaces are corrupted
Solution Approach 1:
The invention replaces mechanical removal processes (sand blasting, wire brushing) with chemical or electrical debonding mechanisms. The debonding agent or electrical stimulus selectively breaks the adhesive bonds without mechanical contact to the substrate, eliminating the harmful mechanical effects while achieving complete adhesive removal for substrate reuse.
Solution Approach 2:
A debonding agent or electrical field acts as an intermediary between the adhesive bond and the substrate. This intermediary selectively targets the adhesive material to break bonds without directly contacting or damaging the substrate surfaces, enabling clean separation and preserving substrate integrity for subsequent applications.
3Ease of repair
If aggressive chemicals or high temperature are applied to debond adhesive, then adhesive debonding is achieved, but substrates are damaged and become unsuitable for subsequent applications
Solution Approach 1:
The invention uses controlled changes in electrical field parameters or chemical composition parameters to achieve debonding. By precisely controlling the voltage, current, or chemical concentration, the debonding process occurs under mild conditions that selectively affect the adhesive without reaching the thresholds that would damage the substrate, thus enabling reuse of expensive substrates.
Solution Approach 2:
The adhesive layer is designed as a disposable, sacrificial element that can be completely removed without affecting the permanent, valuable substrates. The adhesive serves its bonding function and then can be cleanly eliminated through the debonding mechanism, allowing the expensive substrates to be reused while the adhesive is replaced, effectively treating the adhesive as a consumable component.
4Reliability
If adhesive bonds are used instead of mechanical fasteners, then stress distribution and sealing are improved, but disassembly becomes difficult when electrical potential is applied
Solution Approach 1:
The adhesive system is designed to perform multiple functions: it provides structural bonding with stress distribution like conventional adhesives, and simultaneously incorporates electroactive or chemically responsive properties that enable controlled debonding. This multi-functionality allows the same adhesive layer to serve both as a reliable structural bond and as a controllable, reversible connection, resolving the contradiction between reliability and operational flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective bonding and easy debonding of composite structures by applying an electrical potential, preserving substrate integrity and facilitating repair, repurpose, and recycling of components.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 2
an electrically conductive and debondable 2K epoxy adhesive composition comprising a first part comprising: a) an epoxy resin; b) an electrically conductive filler
Data Source
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AI summary
The present invention is directed to an adhesive sheet for use in e-battery bonding comprising: a first electrically conductive foil; a second electrically conductive foil; and an electrically conductive and debondable 2K epoxy adhesive composition, wherein the electrically conductive and debondable 2K epoxy adhesive composition is disposed between the first and second conductive foils.