Conductive Epoxy Slot Shield for EMI Attenuation
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Solution Overview
Problem
High-frequency signal operations in security modules within host devices lead to significant electromagnetic interference (EMI), which can compromise security and is difficult to mitigate without increasing manufacturing costs or compromising physical access, especially through slots or ports where security modules are inserted.
Innovation Solution
An interface module with a housing and conductive epoxy or resin flap that provides a movable slot shield to attenuate EMI, combined with a conductive housing and pathways covered by alternating non-conducting and conducting materials to minimize EMI propagation, allowing for secure and cost-effective shielding without port covers or external screening layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a port cover is used to shield the slot, then EMI radiation is reduced, but physical access to insert/remove security modules becomes difficult
Solution Approach 1:
The slot shield is designed as a movable component that can dynamically change position between blocking the slot during operation and allowing access during insertion/removal. The spring mechanism automatically moves the shield to the blocking position when the security module is inserted, providing EMI shielding during operation while allowing easy access during module changes.
Solution Approach 2:
The spring-loaded mechanism provides automatic operation of the slot shield without requiring manual intervention. When a security module is inserted into the slot, the spring automatically pushes the slot shield into the blocking position, and when the module is removed, the spring returns the shield to the unblocking position, eliminating the need for manual control.
2Object-generated harmful factors
If screening layers are applied to the security module, then EMI is reduced, but manufacturing cost increases
Solution Approach 1:
The EMI shielding function is extracted from the security module itself and relocated to the host device's slot shield. This allows the security module to remain simple and inexpensive while the shielding functionality is provided by the host device's movable slot shield mechanism, reducing overall manufacturing costs.
Solution Approach 2:
The slot shield is implemented as a thin, flexible component that can be easily manufactured and integrated into the host device. The spring-loaded mechanism allows this thin shield to effectively block EMI during operation while maintaining cost-effectiveness compared to applying permanent screening layers to the security module.
3Ease of operation
If the slot is left open for access, then physical access is maintained, but EMI leaks from the housing
Solution Approach 1:
The slot shield dynamically transitions between open and closed positions based on operational needs. During security module insertion and removal, the shield is in the unblocking position allowing physical access. During operation, the shield automatically moves to the blocking position to prevent EMI leakage, thus maintaining both accessibility and EMI protection.
Solution Approach 2:
The spring mechanism pre-positions the slot shield to automatically block the slot as soon as a security module is inserted, preventing EMI leakage before it can occur during operation. This preliminary action ensures that the shielding is in place before any EMI-generating operations begin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces EMI both internally and externally, maintaining security and ease of access while minimizing manufacturing costs by using conductive materials and designs that form a seal around the security module, thereby preventing EMI leakage and interference.
Implementation Method 1
a movable slot shield for attenuating propagation of electromagnetic interference generated inside the housing or generated outside the housing
Implementation Method 2
said movable slot shield being made from one of electrically conductive epoxy or electrically conductive resin
Implementation Method 3
at least one pathway extending from a point where the electrical contact is made is covered by alternate layers of one of non-conducting and conducting adhesives, non-conducting and conducting tapes, non-conducting and conducting resins or non-conducting and conducting epoxies
Data Source
AI summary
The present invention may be deployed in a system comprising a security module housed on a chip card and a host device comprising a chip card reader. The host device is comprised in a housing with a slot for the chip card. The housing is shielded to reduce the amount of electromagnetic radiation generated by the security module and/or the host device from penetrating to the exterior of the housing. Similarly, the shielding is adapted to reduce the effects of electromagnetic radiation generated outside of the host device on the components within the housing. The slot is also shielded by a flap made of an electrically conductive epoxy material or an electrically conductive resin.