Conductive Fabric with Linear Bend for Compact Flexible Circuits
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conductive members with small bend radii face challenges in maintaining conductivity when repeatedly bent, as existing solutions like flexible printed circuit boards often rupture at acute angles, and methods to inhibit bend radius reduction result in increased thickness and bulkiness.
Innovation Solution
A conductive member featuring a conductive fabric with a metal coating applied via wet plating on synthetic fibers, incorporating a linear bend with a bend radius of 0.5 mm or less and an angle between the warp and weft of 5 to 45°, providing enhanced durability and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If flexible printed circuit boards are bent at acute angles with small bend radii, then the instrument size and thickness can be reduced, but the resin films of base materials rupture and conductivity cannot be maintained
Solution Approach 1:
The patent changes the material parameters from traditional resin film base materials to a fabric base material with metal coating. This parameter change allows the conductive member to withstand small bend radii (0.5 mm or less) and acute angle bending without rupture, while maintaining conductivity through the flexible fabric structure that can accommodate repeated bending cycles.
Solution Approach 2:
The patent employs a composite material structure consisting of a fabric base material combined with metal coating layers. This composite construction provides both the flexibility needed for small bend radii and the conductivity required for electrical connections. The fabric structure prevents rupture at acute angles while the metal coating ensures continuous electrical conductivity during repeated bending.
2Shape
If an inhibition film is disposed on the inside of the bend to prevent curvature radius reduction, then bend radius can be maintained, but the flexible printed circuit board thickness increases and the periphery becomes bulky
Solution Approach 1:
Instead of adding an inhibition film that increases thickness, the patent changes the base material parameters to use a fabric structure with metal coating. This allows the conductive member to achieve small bend radii (0.5 mm or less) without requiring additional protective films, thereby avoiding increased thickness and bulkiness while maintaining the desired bend shape.
3Reliability
If the thickness of flexible printed circuit board is increased to prevent rupture, then conductivity can be maintained, but reductions in instrument size and thickness are precluded
Solution Approach 1:
The patent uses a composite material system where a fabric base material provides structural flexibility and resistance to rupture during bending, while thin metal coating layers provide electrical conductivity. This composite approach maintains conductivity without increasing overall thickness, enabling instrument miniaturization while ensuring reliable electrical connections during repeated bending cycles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive member achieves superior durability and compact folding while maintaining conductivity through repeated bending, outperforming traditional flexible printed circuit boards in terms of flexibility and resistance to bending stress.
Implementation Method 1
a conductive fabric obtained by layering a metal coating, formed by a wet plating method, on a fabric including a synthetic fiber
Data Source
AI summary
A conductive member includes a conductive fabric containing warp and weft as well as a support, includes at least one linear bend, and is imparted with electrical conductivity across the linear bend. In the conductive member, an angle formed between the linear bend and one of the warp and the weft is 5 to 45° C. The conductive fabric is preferably a conductive fabric obtained by layering a metal coating, formed by a wet plating method, on a fabric including a synthetic fiber.