Conductive Fabric Electronic Module Snap-Fastener Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for assembling electronic modules on conductive fabrics are labor-intensive and unsuitable for high-volume or automated production, and they often fail to maintain a secure connection as the fabric flexes, with some conductive fabrics being incompatible with high-temperature joining techniques.
Innovation Solution
An electronic module assembly method involving a non-conductive fabric substrate with a conductive fabric covering, where an electronics module with through holes is aligned with the conductive fabric and secured using a conductive fastener that passes through the holes, forming a durable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional stitching methods are used to attach electronic modules to conductive fabric, then the assembly can be formed, but the process is labor-intensive and unsuitable for high-volume or automated production
Solution Approach 1:
The patent replaces the conventional mechanical stitching process with a snap-fit attachment system. The snap fastener consists of a male portion that engages with a female portion, allowing automated assembly through simple insertion and engagement motions rather than intensive stitching operations. This mechanical substitution enables high-volume production while maintaining ease of manufacture.
Solution Approach 2:
The attachment system is segmented into separate male and female portions of the snap fastener. The male portion is integrated with or attached to the electronic module, while the female portion is attached to the conductive fabric. This segmentation allows independent optimization of each component and simplifies the assembly process, contributing to both automated manufacturability and high-volume production capability.
2Reliability
If stitching is used to attach the module to the fabric, then the module can be secured, but the stitches become loose as the fabric flexes
Solution Approach 1:
The snap fastener attachment system is designed to accommodate fabric flexibility. The fastener components are positioned and dimensioned to allow the conductive fabric to flex while maintaining secure engagement. The male and female snap portions can accommodate slight movements and deformations of the fabric without disengaging, thus maintaining connection stability while preserving fabric adaptability.
Solution Approach 2:
The snap-fit attachment system provides a dynamic connection that can accommodate fabric movement. Unlike rigid stitching that constrains fabric motion, the snap fastener allows the fabric to flex and move within certain limits while maintaining the electrical and mechanical connection. This dynamic attachment method resolves the contradiction between connection stability and fabric flexibility.
3Strength
If high-temperature joining techniques are used, then strong bonds can be formed, but some conductive fabrics are not well suited for these techniques
Solution Approach 1:
The patent replaces thermal joining processes with a mechanical snap-fit attachment system. The male and female snap portions are joined through mechanical engagement rather than thermal bonding, eliminating the need for high-temperature processes that could damage temperature-sensitive conductive fabrics. This substitution achieves secure attachment without exposing the fabric to harmful thermal effects.
Solution Approach 2:
The snap fastener acts as an intermediary attachment mechanism between the electronic module and the conductive fabric. Rather than directly bonding the module to the fabric using high-temperature techniques, the snap fastener provides an intermediate mechanical connection that is gentle on the fabric while still achieving strong attachment. This intermediary approach avoids direct thermal exposure of the fabric.
Data Source
AI summary
An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.


