Conductive fiber composites containing multi-scale high conductive particles and methods
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Solution Overview
Problem
Advanced composite materials exhibit low through-thickness thermal conductivity, limiting their use in applications requiring effective thermal management, such as aerospace and electronics, due to the absence of fibers in the through-thickness direction and insulating resin-rich areas between fiber tows and layers.
Innovation Solution
Incorporating nanoscale and microscale high-conductive particles, such as silver, copper, or aluminum, into the composite materials to form continuous conductive paths through the thickness direction, enhancing thermal conductivity by at least 4.0 W/(m·K, with the particles being distributed in a way that penetrates fiber tows and bridges resin-rich areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional laminated composite structures are used, then mechanical strength and stiffness are improved, but through-thickness thermal conductivity deteriorates due to insulating resin-rich areas between fiber tows and layers
Solution Approach 1:
The patent applies composite materials by combining traditional carbon fiber reinforced polymer composites with conductive filler particles (metallic, ceramic, or carbon-based). This creates a multi-phase composite system where the conductive fillers form thermal conduction pathways through the resin-rich areas, enabling the material to simultaneously maintain mechanical strength and improve through-thickness thermal conductivity.
Solution Approach 2:
The patent applies local quality by concentrating conductive filler particles specifically in the resin-rich areas between fiber tows and laminated layers. This localized distribution targets the specific regions that impede heat transfer, allowing thermal conductivity to be improved at the interfaces without compromising the overall mechanical structure of the composite.
2Temperature
If conductive filler particles are added to improve thermal conductivity, then through-thickness thermal conductivity is improved, but manufacturing complexity increases due to multi-scale particle distribution requirements
Solution Approach 1:
The patent applies segmentation by using multi-scale filler particles with different size ranges (e.g., 1-10 micrometers, 10-50 micrometers, 50-100 micrometers). This segmentation of particle sizes allows different scales of fillers to occupy different spaces and form complementary conduction pathways, improving thermal conductivity while managing manufacturing complexity through hierarchical structuring.
Solution Approach 2:
The patent applies parameter changes by systematically varying the size distribution, shape, and concentration of conductive filler particles. By optimizing these parameters, the patent achieves effective thermal conduction pathways while controlling viscosity, processability, and manufacturing complexity. The specific parameter ranges provided (e.g., volume fractions, size distributions) represent optimized values that balance thermal performance with manufacturability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The combination of nanoscale and microscale particles significantly increases the through-thickness thermal conductivity of composite materials, enabling their use in high-performance applications by creating effective thermal management capabilities.
Implementation Method 1
nanoscale and microscale high-conductive particles, such as silver, copper, or aluminum, into the composite materials to form continuous conductive paths through the thickness direction, enhancing thermal conductivity by at least 4.0 W/(m·K)
Data Source
AI summary
Composite materials are provided that include a host material, nanoscale high conductive particles, and microscale high conductive particles. The nanoscale high conductive particles and the microscale high conductive particles may increase the through thickness thermal conductivity of the composite material by at least 4.0 W/(m·K), as compared to the same composite material without the nanoscale high conductive particles and microscale high conductive particles. Methods for making the composite materials herein also are provided.