Conductive-Filler Encapsulant for Semiconductor Package Heat Dissipation
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving efficient heat dissipation and reducing device defects in package-on-package (PoP) technology due to the need for smaller packaging techniques and higher integration densities, which are not adequately addressed by existing packaging methods.
Innovation Solution
The implementation of an insulation layer over interconnect structures, vias, and semiconductor dies, combined with a molding compound containing conductive fillers, provides electrical isolation and thermal conductivity, allowing for the use of materials with higher thermal expansion coefficients and conductivities, thereby enhancing heat dissipation and reducing stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional packaging methods are used to achieve smaller packaging techniques and higher integration density, then device footprint is reduced, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies composite materials by formulating a molding compound that integrates both thermally conductive fillers (such as aluminum oxide, aluminum nitride, or diamond particles) and electrically conductive fillers (such as metal powders or carbon-based materials) within a polymer matrix. This composite structure enables the encapsulant to simultaneously provide thermal management and electrical interconnection functions, resolving the contradiction between compact packaging and heat dissipation efficiency.
Solution Approach 2:
The molding compound is designed to perform multiple functions simultaneously: structural encapsulation, thermal conduction, and electrical conduction. By integrating these functions into a single material system, the patent eliminates the need for separate thermal interface materials and conductive pathways, thereby maintaining small package size while improving heat dissipation efficiency.
2Temperature
If materials with higher thermal expansion coefficients are used to improve thermal conductivity, then heat dissipation is enhanced, but stress between materials increases
Solution Approach 1:
The patent employs parameter changes by carefully selecting and optimizing the composition ratios, particle sizes, and shapes of both thermally conductive and electrically conductive fillers within the molding compound. By adjusting these parameters, the material achieves high thermal conductivity while its coefficient of thermal expansion can be tuned to match surrounding components, thereby reducing thermal stress during temperature cycling.
Solution Approach 2:
The patent applies local quality by creating regions with different filler concentrations and distributions within the molding compound. Areas closer to heat-generating components may have higher concentrations of thermally conductive fillers, while other regions are optimized for stress management. This spatial variation in material properties allows simultaneous achievement of high thermal conductivity and reduced material stress.
3Reliability
If electrically conductive materials are used in the molding compound, then electrical isolation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the functions of electrical isolation and thermal conduction into a single molding compound formulation. By incorporating both electrically conductive and thermally conductive fillers in specific combinations, the material provides inherent electrical isolation properties while maintaining thermal management capabilities, thereby simplifying the manufacturing process compared to using multiple separate materials or additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation, enhances device performance, and reduces defects by enabling the use of materials with higher thermal conductivities and expansion coefficients, thus optimizing the packaging process for semiconductor devices.
Implementation Method 1
a molding compound over the insulation layer, the molding compound configured to conduct heat from the semiconductor die
Implementation Method 2
The insulation layer may electrically insulating and may isolate the via and any exposed conductive features of the interconnect structure and the semiconductor die from one another
Implementation Method 3
allows for materials having higher thermal expansion coefficients to be used for the molding compound
Data Source
AI summary
Packaged semiconductor devices including high-thermal conductivity molding compounds and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first redistribution structure; a first die over and electrically coupled to the first redistribution structure; a first through via over and electrically coupled to the first redistribution structure; an insulation layer extending along the first redistribution structure, the first die, and the first through via; and an encapsulant over the insulation layer, the encapsulant surrounding portions of the first through via and the first die, the encapsulant including conductive fillers at a concentration ranging from 70% to about 95% by volume.