Two-Layer Conductive Film Curing for Rub-Resistant EMI Shielding
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Solution Overview
Problem
Existing methods for manufacturing conductive films for electromagnetic wave shielding bodies face challenges in achieving sufficient rub resistance and design flexibility due to thick film thickness and heavy weight issues with conventional shielding techniques.
Innovation Solution
A manufacturing method involving the use of two inks containing metal salts or metal complexes, where a first conductive film is formed on a substrate through heating or light irradiation, followed by a second conductive film with specific curing treatments to enhance film continuity and rub resistance, with the option of forming an insulating film for improved adhesion and shielding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional shield can techniques are used for electromagnetic wave shielding, then shielding effectiveness is improved, but weight and film thickness increase
Solution Approach 1:
The patent replaces conventional thick shield cans with thin-film conductive layers formed by printing metal patterns on insulating films. This thin-film approach maintains electromagnetic wave shielding effectiveness while dramatically reducing weight and thickness, directly resolving the contradiction between shielding effectiveness and weight.
Solution Approach 2:
The patent changes the physical parameters of the shielding structure by transitioning from bulk metal shield cans to thin conductive films with optimized pattern designs. By adjusting film thickness, metal pattern density, and layer configuration, the patent achieves effective shielding with reduced weight and thickness parameters.
2Reliability
If conventional shield can techniques are used for electromagnetic wave shielding, then shielding effectiveness is improved, but design freedom is reduced
Solution Approach 1:
The thin-film conductive structure can be flexibly integrated into various substrates and device configurations, enabling diverse design applications while maintaining shielding effectiveness. The flexibility of thin films allows adaptation to different shapes and mounting requirements, restoring design freedom.
Solution Approach 2:
The patent uses composite structures combining insulating films with printed metal patterns to create lightweight, flexible shielding layers. This composite approach enables customization of electrical and mechanical properties, enhancing design versatility while preserving shielding performance.
3Reliability
If multiple conductive films are laminated to increase thickness, then conductivity is improved, but rub resistance deteriorates
Solution Approach 1:
The patent creates a composite conductive film structure with a base layer providing mechanical strength and rub resistance, and additional conductive layers enhancing electrical conductivity. This composite configuration achieves high conductivity without compromising surface durability, resolving the contradiction between conductivity and rub resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method produces conductive films with excellent rub resistance and flexibility, enabling effective electromagnetic wave shielding while reducing material thickness and weight, thus improving the performance and design capabilities of shielding bodies.
Implementation Method 1
subjecting the first coating film to at least one first curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a first conductive film
Implementation Method 2
subjecting the second coating film to at least one second curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a second conductive film
Implementation Method 3
subjecting the first coating film to at least one first curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a first conductive film
Data Source
AI summary
An object of the present invention is to provide a manufacturing method of a conductor capable of forming a conductive film having excellent rub resistance. Another object of the present invention is to provide a manufacturing method of an electromagnetic wave shielding body, and a conductor.The manufacturing method of a conductor of the present invention includes an ink preparation step of preparing a first ink containing at least a metal salt or a metal complex and a second ink containing at least a metal salt or a metal complex, a step 1 of forming a first coating film on a substrate using the first ink, and subjecting the first coating film to at least one first curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a first conductive film, and a step 2 of forming a second coating film on the first conductive film using the second ink, and subjecting the second coating film to at least one second curing treatment selected from the group consisting of a heating treatment and a light irradiating treatment to form a second conductive film, in which thicknesses of the first coating film and the second coating film and treatment conditions of the first curing treatment and the second curing treatment satisfy predetermined relational expressions.