Transparent Conductive Multilayer Film With Processable Dielectric Coating
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Solution Overview
Problem
Conductive multilayer films face challenges in adhesion and processing stability due to detachment of layers during use, and existing technologies do not effectively utilize transparent dielectric materials for protection and further processing of transparent conductor layers.
Innovation Solution
A conductive multilayer film with a non-conductive base layer and a transparent layer comprising a conductive high aspect ratio molecular structure (HARMS) network, covered with a transparent dielectric material coating layer, specifically using polymers like polyvinylidene chloride (PVDC) or poly(methyl methacrylate) (PMMA), to enhance adhesion and enable processing such as patterning or printing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If multiple layers of different materials are used to form conductive multilayer films, then improved strength, stability, and appearance are achieved, but adhesion and bonding ability between layers becomes problematic causing detachment during use
Solution Approach 1:
A coating layer comprising polyvinylidene chloride or poly(methyl methacrylate) is introduced as an intermediary between the transparent conductor layer and external processing environments. This coating layer acts as a protective mediator that prevents direct exposure to processing conditions while maintaining layer adhesion and enabling further manufacturing steps without causing layer detachment.
2Reliability
If a coating layer of transparent dielectric material is applied to protect the transparent conductor layer, then adhesion and processing stability are improved, but the thickness must be precisely controlled to enable further processing through the coating layer
Solution Approach 1:
The coating layer thickness is precisely controlled within the range of 50-150 nm, which is sufficiently thick to provide protection and improve processing stability, yet thin enough to allow laser processing to effectively penetrate through the coating layer to pattern the transparent conductor layer beneath. This precise parameter control resolves the contradiction between protection and processability.
3Stability of the object's composition
If the coating layer thickness is increased to improve protection, then adhesion and stability are enhanced, but processing of the transparent layer through the coating layer becomes difficult
Solution Approach 1:
The coating layer thickness is optimized to 50-150 nm, providing sufficient environmental stability and protection while remaining thin enough to allow laser processing to penetrate and pattern the transparent conductor layer effectively. This precise thickness control enables both protection and ease of manufacturing.
Solution Approach 2:
Laser processing is used to pattern the transparent conductor layer through the coating layer, replacing traditional mechanical processing methods. The laser can effectively penetrate the thin coating layer (50-150 nm) to pattern the conductive material beneath, enabling further manufacturing steps without compromising the protective function of the coating.
Data Source
Figure 1~2
AI summary
An electrically conductive multilayer film is disclosed. The conductive multilayer film may comprise a non- conductive base layer and a transparent layer comprising transparent conductor material provided on the non-conductive base layer, wherein the transparent layer comprising transparent conductor material is at least partly covered with transparent dielectric material forming a coating layer on the transparent layer comprising transparent conductor material such that the transparent layer comprising transparent conductor material is situated between the coating layer and the non-conductive base layer, and wherein the thickness of the coating layer is 10–600 nm in order to enable processing of the transparent layer comprising transparent conductor material through the coating layer. Further is disclosed a method, a touch sensing device, and different uses.