Conductive Film Interface Structure for Resin Layer Adhesion
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Solution Overview
Problem
Conductive films with a second resin layer forming trenches filled with a conductive layer on a first resin layer face challenges in achieving high adhesion between the two resin layers, which is crucial for their performance in flexible and transparent applications such as touch panels and displays.
Innovation Solution
A conductive film design featuring a base material with a first resin layer containing protruding inorganic particles and a second resin layer with unevenly distributed smaller inorganic particles, enhancing adhesion through increased surface contact and improved distribution of particles, allowing for better mechanical and optical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a second resin layer is formed on a first resin layer to create trenches for conductive layers, then the conductive film can be manufactured with transparent and conductive properties, but the adhesion between the two resin layers becomes insufficient
Solution Approach 1:
The patent applies local quality by introducing inorganic particles specifically at the interface between the first and second resin layers. These particles are not uniformly distributed throughout the entire structure but are localized at the critical adhesion interface, providing enhanced bonding strength exactly where needed without affecting other properties of the resin layers.
Solution Approach 2:
The patent employs composite materials by combining organic resin components with inorganic particles to create a hybrid interface layer. This composite structure leverages the advantages of both material types: the resin provides flexibility and transparency while the inorganic particles provide mechanical interlocking and adhesion strength, resolving the contradiction between ease of manufacture and reliability.
2Strength
If inorganic particles are added to enhance adhesion between resin layers, then the mechanical strength improves, but the transparency of the conductive film may deteriorate
Solution Approach 1:
The patent applies parameter changes by carefully controlling the size, shape, and concentration of inorganic particles to optimize both adhesion and transparency. By adjusting these parameters, the particles provide mechanical strength while minimizing light scattering and absorption, thus maintaining the transparency required for display applications.
Solution Approach 2:
The inorganic particles are localized specifically at the interface region between resin layers rather than being uniformly distributed throughout the entire conductive film. This local concentration ensures that transparency is maintained in the bulk material while adhesion is enhanced at the critical interface, resolving the contradiction between strength and illumination intensity.
Data Source
AI summary
A conductive film includes a base material 1, a first resin layer 10 provided on the base material 1, a second resin layer 20 provided on the first resin layer 10 and having a trench 25 opening to a surface opposite to the first resin layer 10, and a conductive layer 30 provided in the trench 25. The first resin layer 10 contains a first resin portion 12 and a plurality of first inorganic particles 11. At least a part of the plurality of first inorganic particles 11 partially protrude from the first resin portion 12 toward the second resin layer 20.