Conductive Film EMI Shielding Semiconductor Package
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Solution Overview
Problem
Existing semiconductor packages face challenges in effectively shielding chips from electromagnetic interference (EMI) without increasing production complexity and cost, as they require additional shield elements.
Innovation Solution
An EMI shielded semiconductor package is designed with a substrate, chip, bonding wires, shielding conductive blocks, and a conductive film that overlays a sealant to connect electrically with the ground trace, eliminating the need for additional shield elements by using a conductive film to shield the chip and surrounding devices from EMI.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a cover with inner cup and inner lining is used to shield the chip, then EMI shielding is achieved, but production complexity and labor increase
Solution Approach 1:
The patent combines the shielding function with the existing sealant structure by forming a conductive film on the sealant's outer surface. This merges the sealing function and EMI shielding function into a single integrated structure, eliminating the need for separate shield elements and reducing production complexity.
Solution Approach 2:
The sealant structure is given multiple functions: it provides both mechanical sealing protection and EMI shielding. By making the sealant conductive through the conductive film, it serves dual purposes, reducing the number of separate components needed.
2Object-affected harmful factors
If an additional shield element is used to cover the chip, then EMI shielding is achieved, but production cost and complexity increase
Solution Approach 1:
The shielding function is merged into the existing sealant structure rather than adding a separate shield element. The conductive film formed on the sealant provides shielding while utilizing the already-present sealant structure, thereby reducing material costs and assembly steps.
Solution Approach 2:
The sealant structure serves its own additional function of EMI shielding through the conductive film, eliminating the need for separate shield components. The structure that already exists (sealant) is enhanced to provide both sealing and shielding functions.
3Object-affected harmful factors
If multiple layers of conductive material are used (outer cup, inner cup, inner lining), then EMI shielding effectiveness is improved, but manufacturing labor increases
Solution Approach 1:
Multiple shielding functions are merged into a single conductive film layer on the sealant. Instead of using multiple separate conductive layers (outer cup, inner cup, inner lining), the invention achieves equivalent or sufficient shielding with one conductive film, significantly reducing assembly steps and labor time.
Solution Approach 2:
The single conductive film on the sealant performs the shielding function that previously required multiple separate conductive components, reducing the number of manufacturing steps while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides effective EMI shielding for the chip and surrounding devices without the need for additional shield elements, simplifying production and reducing costs by integrating the shielding function into the existing structure.
Implementation Method 1
the conductive film is capable of shielding the chip in the package from electromagnetic interference
Data Source
AI summary
An EMI shielded semiconductor package is provided. The package includes a substrate and a chip disposed on the substrate. The chip is electrically connected to the substrate by a plurality of bonding wires. At least one shielding conductive block is formed on the substrate and electrically connected to the ground trace of the substrate. A sealant is formed on the substrate and covers the chip, bonding wires and the shielding conductive block. The sealant has a side surface to expose a surface of the shielding conductive block. A layer of conductive film is formed on the outer surface of the sealant and covers the exposed surface of the shielding conductive block thereby shielding the chip from electromagnetic interference.