Conductive Film Shielding SRAM From Radioactive Rays
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Solution Overview
Problem
Semiconductor devices face challenges in shielding SRAM circuits from radioactive rays, such as α rays, emitted from substrate materials, which can cause soft errors due to the difficulty in effectively isolating these circuits from radiation using existing substrate wirings.
Innovation Solution
A conductive film is disposed on the substrate's main face, overlapping the SRAM circuit and extending between bump electrodes, providing efficient shielding of radioactive rays and maintaining electrical insulation from electrode patterns, thereby preventing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If substrate wirings are used to shield SRAM circuits from radioactive rays, then shielding effect is provided, but electrical insulation from electrode patterns cannot be ensured
Solution Approach 1:
The conductive film is divided into multiple independent shielding portions, each corresponding to different electrode patterns. These portions are electrically isolated from each other, allowing each to be independently connected to different electrode patterns without causing electrical interference, thus maintaining both shielding effectiveness and electrical insulation
Solution Approach 2:
The conductive film acts as an intermediary layer between the substrate and the semiconductor chip. It provides shielding from radioactive rays while its segmented structure and selective electrical connections prevent direct electrical interference with the bump electrodes, mediating between radiation protection and electrical isolation requirements
2Object-affected harmful factors
If a conductive film is added to shield SRAM circuits, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The conductive film serves multiple functions simultaneously: it shields the SRAM circuit from radioactive rays, provides electrical connection pathways when connected to electrode patterns, and maintains electrical insulation when segmented and unconnected. This multi-functionality reduces the need for separate components for each function
Solution Approach 2:
The electrical connection state of the conductive film is changed dynamically or selectively - it can be connected to electrode patterns in some regions and isolated in other regions. This parameter change allows the same conductive film structure to provide both shielding and selective electrical connection without increasing overall device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive film effectively shields SRAM circuits from radioactive rays, reducing the occurrence of soft errors and ensuring reliable signal transmission while being electrically insulated to prevent interference.
Implementation Method 1
A conductive film overlapping the SRAM circuit in a direction perpendicular to the main face extends planarly between a plurality of bump electrodes, thereby the SRAM circuit can be effectively shielded from radioactive rays
Data Source
AI summary
According to one embodiment, there is provided a semiconductor device including a substrate, a semiconductor chip, and a conductive film. The substrate has a main face. The semiconductor chip has a surface equipped with an SRAM circuit. The semiconductor chip is mounted on the main face via a plurality of bump electrodes in a state where the surface faces the main face. The conductive film is disposed on the main face or the surface. The conductive film extends planarly between the plurality of bump electrodes. A region in the main face or the surface where the conductive film is disposed overlaps the SRAM circuit in a direction perpendicular to the main face.