Conductive Fluid Cooling Head for Semiconductor Power Delivery
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Solution Overview
Problem
High-performance semiconductor integrated circuits face challenges in heat dissipation and power supply reliability due to increased heat generation and limited current capacity at terminals, necessitating an efficient solution for both cooling and power delivery.
Innovation Solution
A power supply system that utilizes a conductive fluid and magnetic field interaction to induce an electromotive force, driving the semiconductor integrated circuit while effectively cooling it through a substrate with a fluid channel and micro-channel structure, and includes a temperature detection and control unit for stable operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is provided on the upper portion of a chip to liberate heat, then heat dissipation is improved, but heat generation at high packing densities exceeds the dissipation capability
Solution Approach 1:
The patent employs a liquid cooling system with cooling channels formed in a substrate. Conductive fluid is circulated through these channels to directly remove heat from the semiconductor device, replacing conventional air-cooled heat sinks and enabling effective heat dissipation at high packing densities.
Solution Approach 2:
The patent combines cooling and power supply functions into a single integrated system. The same conductive fluid that cools the device through the substrate also serves as the medium for electromagnetic induction to generate power, merging two previously separate functions into one unified approach.
2Reliability
If conventional power supply methods are used through terminals, then power delivery is simple, but the terminal has limited current capacity which adversely affects reliability
Solution Approach 1:
The patent uses a liquid conductive fluid as the power transmission medium, replacing conventional electrical terminals. This fluid-based approach allows for higher current capacity and improved reliability by eliminating terminal limitations, while the fluid's conductivity enables electromagnetic induction for power generation.
Solution Approach 2:
The patent changes the physical state and properties of the power transmission medium from solid electrical contacts to a liquid conductive fluid. This parameter change enables higher current capacity, improved heat transfer, and the ability to generate power through electromagnetic induction while the fluid flows through the system.
3Ease of manufacture
If separate systems are used for cooling and power supply, then each function can be optimized independently, but the system complexity increases
Solution Approach 1:
The patent merges cooling and power supply functions into a single integrated system using a conductive fluid. The fluid simultaneously performs heat removal through convection and enables power generation through electromagnetic induction, eliminating the need for separate cooling and power supply systems and reducing overall system complexity.
Solution Approach 2:
The conductive fluid serves multiple functions within the system: it acts as a cooling medium to remove heat, as an electrical conductor for electromagnetic induction, and as a power transmission carrier. This multi-functionality reduces the number of separate components needed and simplifies the overall system architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enhances heat transport efficiency, addresses power supply reliability, and provides stable cooling and power delivery to semiconductor integrated circuits, reducing heat loss and eliminating the limitations of conventional power supply methods.
Implementation Method 1
A conductive fluid selected as the cooling medium can be subjected to a magnetic field for the conductive fluid and the magnetic field to interact with each other, thereby causing an electromotive force to be induced according to Faraday's law of electromagnetic induction
Implementation Method 2
A conductive fluid selected as the cooling medium can be subjected to a magnetic field
Data Source
AI summary
An electromotive cooling head includes a substrate, an N-pole magnet, and an S-pole magnet, and kept in intimate contact with the backside of the semiconductor integrated circuit so as to cover it. The substrate has a fluid channel having a micro-channel structure, through which a conductive fluid flows. An anode and a cathode are disposed to sandwich the fluid channel. The conductive fluid interacts with a magnetic field to thereby induce an electromotive force between the anode and the cathode. A circuit includes, on its backside, a power supply voltage terminal and a ground terminal, and is driven by the electromotive force induced in the electromotive cooling head.