Conductive Foil Member for Fast Shield Film Transfer
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Solution Overview
Problem
The existing method of forming a shield film on electronic components using sputtering is time-consuming, making it inefficient for reducing the size and height of electronic devices.
Innovation Solution
A conductive member comprising an adhesive layer with conductive particles and a pre-formed metal foil layer, which is applied to the device to form a metal film, allowing for a simpler and more efficient process while ensuring uniformity and stability of the shield performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sputtering is used to form a shield film on electronic components, then the electronic device size and height can be reduced, but the film forming process takes a long time
Solution Approach 1:
The metal foil layer is formed in advance on a separate substrate before being transferred to the electronic component. This preliminary formation of the metal film allows for faster production since the time-consuming sputtering process is performed separately rather than in-situ on each component, thereby reducing the overall film forming time while maintaining the reduced device size benefit.
2Volume of moving object
If a thin metal foil layer (25 μm or less) is used to reduce device size, then the electronic device height is reduced, but the shield performance may be compromised
Solution Approach 1:
The invention uses a composite structure consisting of a flexible substrate and a metal foil layer with specific thickness (25 μm or less). The combination of these materials achieves both the size reduction goal and maintains adequate shield performance through optimized material selection and layer configuration, resolving the contradiction between thinness and effectiveness.
3Ease of manufacture
If the metal foil layer is formed in advance on a separate substrate, then the metal film formation process is simplified, but additional handling and transfer steps are required
Solution Approach 1:
The invention combines the metal film formation process with the substrate preparation in a single integrated manufacturing step. The metal foil is deposited on a flexible substrate that will later be transferred to the electronic component, merging what would otherwise be separate operations into one consolidated process, thereby simplifying overall manufacturing despite the additional transfer step.
Data Source
AI summary
A conductive member includes an adhesive layer and a metal foil layer. The adhesive layer consists of an adhesive composition containing conductive particles. The metal foil layer is disposed on the adhesive layer. The conductive member can be used to form, for example, a predetermined metal film.