Conductive Foil Metallization for Solar Cell Electrical Contacts

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Solution Overview

Problem

Existing metallization methods for solar cells are inefficient due to the challenges of setting up and processing numerous wires for bonding conductive foil to semiconductor substrates, particularly in forming conductive contacts.

Innovation Solution

The method involves separating and bonding cut portions from conductive foil to semiconductor substrates using a system comprising a dispenser unit, separation unit, aligner, and bonding unit, which includes processes like laser cutting, mechanical separation, and thermocompression bonding, to efficiently form conductive contacts on solar cells.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional wire-based bonding methods are used to form conductive contacts on solar cells, then reliable electrical connections can be achieved, but the setup complexity and processing time increase significantly due to handling numerous individual wires

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidwire handling complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive foil is divided into multiple cut portions, each corresponding to a specific doped region on the solar cell. This segmentation allows each foil portion to be independently bonded to the appropriate contact region, replacing the need for numerous individual wires while maintaining reliable electrical connections.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple wire functions are merged into a single conductive foil structure. The foil integrates the electrical connection function that previously required multiple separate wires, simplifying the overall device complexity while preserving the reliability of electrical connections through the continuous conductive path provided by the foil.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If traditional wire-based bonding methods are used to form conductive contacts, then electrical connections can be established, but the manufacturing efficiency decreases due to time-consuming wire setup and processing

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmanufacturing efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The conductive foil is pre-cut into multiple portions before the bonding process. This preliminary action eliminates the need for time-consuming wire setup and individual handling during manufacturing, significantly improving productivity while ensuring each cut portion is ready for precise bonding to the corresponding doped region.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The mechanical wire bonding process is replaced with a foil-based system that uses laser cutting and thermocompression bonding. This substitution eliminates the complex mechanical setup required for wire handling and enables faster, more efficient processing while maintaining reliable electrical connections.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If conductive foil is used instead of wires, then manufacturing efficiency improves by reducing wire handling complexity, but new processes like laser cutting and thermocompression bonding must be implemented

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidprocess complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The traditional mechanical wire bonding system is replaced with a combination of laser cutting and thermocompression bonding processes. This substitution simplifies the overall manufacturing workflow by eliminating complex wire handling mechanisms, even though it introduces new bonding technology that requires controlled thermal and pressure conditions.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The bonding process transitions from mechanical wire bonding to thermocompression bonding, utilizing controlled temperature and pressure parameters. This parameter change enables efficient foil-to-substrate bonding while reducing the mechanical complexity associated with traditional wire handling and bonding equipment.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the efficiency of solar cell metallization by reducing the complexity of wire handling and improving the bonding process, leading to more effective electrical coupling and potentially higher solar cell performance.

Implementation Method 1

separating unit can include a laser cutting unit

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

The heating unit can heat the conductive foil and the semiconductor substrate to a melting temperature

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 3

The doped regions are connected to conductive regions on the solar cell to direct an electrical current from the cell

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10727369B2Conductive foil based metallization of solar cells
Publication Date: 2020.07.28 MAXEON SOLAR PTE LTD
  • US10727369B2 patent drawing
  • US10727369B2 patent drawing
  • US10727369B2 patent drawing

AI summary

Methods of fabricating a solar cell, and system for electrically coupling solar cells, are described. In an example, the methods for fabricating a solar cell can include forming a first cut portion from a conductive foil. The method can also include aligning the first cut portion to a first doped region of a first semiconductor substrate. The method can include bonding the first cut portion to the first doped region of the first semiconductor substrate. The method can also include aligning and bonding a plurality of cut portions of the conductive foil to a plurality of semiconductor substrates.