Conductive Frame Chip Package Structure Eliminating Molding Compound
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Solution Overview
Problem
Conventional semiconductor packaging processes rely heavily on molding compounds for chip protection, which can lead to environmental pollution and do not efficiently optimize power density and circuit performance in small, portable devices.
Innovation Solution
A chip package structure and manufacturing method utilizing a conductive frame with a bottom plate and partition plates to provide structural support and protection, reducing the need for molding compounds and allowing for customizable chip package designs by adjusting cutting positions for different applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding compound is used to encapsulate the chip, then the chip is protected and structural support is provided, but environmental pollution is caused and power density is not optimized
Solution Approach 1:
The patent removes the molding compound from the packaging process entirely, extracting only the essential protective and structural functions. The chip is packaged using a lead frame structure without any molding compound encapsulation, eliminating the harmful substance while maintaining chip protection through the lead frame's mechanical support and the chip's direct mounting on the circuit board.
2Strength
If molding compound is used to protect the chip, then structural support is provided, but the package size increases and power density decreases
Solution Approach 1:
The molding compound is completely removed from the packaging structure. The lead frame provides structural support through its rigid metallic construction and the chip is directly mounted on the circuit board via the lead frame, eliminating the need for additional encapsulation volume while maintaining mechanical strength.
3Reliability
If conventional packaging process with molding compound is used, then chip protection is achieved, but manufacturing complexity increases
Solution Approach 1:
The complex molding compound application process is completely removed. The packaging is achieved through the lead frame structure and direct chip mounting, eliminating multiple steps such as molding compound application, curing, and trimming that are required in conventional processes.
4Reliability
If solder bumps are used to replace bonding wires, then resistance and parasitic inductance are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The solder bumps are pre-formed on the chip or lead frame before final assembly. This preliminary action allows for precise positioning and alignment to be established early in the manufacturing process, ensuring accurate alignment between the solder bumps and corresponding pads on the circuit board, thereby meeting the high precision requirements.
Data Source
AI summary
A manufacturing method of a chip package structure is provided. Firstly, a conductive frame including a bottom plate and a plurality of partition plates is provided. The bottom plate has a supporting surface and a bottom surface opposite thereto, and the partition plates protrude from the supporting surface to define a plurality of the accommodating regions. Subsequently, a plurality of chips is provided, and each of the chips is correspondingly accommodated in each of the accommodating regions with a back surface facing to the supporting surface. Thereafter, the conductive frame is cut to form a plurality of separated chip package structures.