Conductive Frame Shielding for Stacked PCB Noise
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Solution Overview
Problem
Conventional connector structures in portable electronic devices with stacked PCBs suffer from noise emission due to empty spaces generated by manufacturing methods, which degrade antenna performance, especially in high-frequency next-generation communication systems.
Innovation Solution
A conductive frame is introduced to enclose the space between substrates, grounded to one of the substrates, providing a shielding effect that prevents noise emission and enhances durability by preventing the conductive frame from becoming unfastened or warped.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a stacked-PCB structure is used to reduce mounting space, then the area of the electronic device is reduced, but empty spaces are generated between substrates which emit noise and degrade antenna performance
Solution Approach 1:
A foam filler material is introduced as an intermediary substance to fill the empty space between the first substrate and the second substrate. This foam material acts as a mediator that prevents noise emission while maintaining the compact stacked-PCB structure, thereby resolving the contradiction between reduced mounting space and noise emission.
Solution Approach 2:
The foam filler material functions as a flexible filling substance that can adapt to the empty space between substrates. This flexible material effectively seals the gap to prevent noise emission while accommodating the stacked-PCB configuration, thus resolving the contradiction between compact area and noise control.
2Ease of manufacture
If conventional connector structures are used in stacked-PCB, then manufacturing is simplified, but antenna performance deteriorates due to noise from empty spaces
Solution Approach 1:
The foam filler serves as an intermediary element that is easily integrated into the existing connector structure of stacked-PCB. It fills the empty spaces without complicating the manufacturing process, while effectively preventing noise emission that would degrade antenna performance, thus maintaining ease of manufacture while improving reliability.
3Adaptability or versatility
If high frequency communication is implemented, then next-generation communication services are supported, but antenna performance degrades due to noise emission from empty spaces
Solution Approach 1:
The foam filler material acts as an intermediary that enables high-frequency communication services to function properly by eliminating noise from empty spaces. It allows the device to support next-generation communication services without the performance degradation that would otherwise occur at high frequencies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive frame significantly improves noise-blocking performance and ensures the structural integrity of the stacked-PCB structure, maintaining antenna performance and durability.
Implementation Method 1
a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed
Data Source
AI summary
Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.