Conductive Framework Grounding for Computer Case EMI Reduction

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Solution Overview

Problem

Electromagnetic interference (EMI) generated by electronic components in a computer case can adversely affect interface cards, such as PCIe cards, which existing solutions fail to adequately mitigate.

Innovation Solution

A computer case design featuring a conductive and flexible framework with protrusion portions and main portions that are easily assembled and contact both the mount brackets and interface cards, grounding them to reduce EMI.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a conductive sheet is disposed on the mount bracket to ground the interface card, then electromagnetic interference is reduced, but the assembly process becomes complex and time-consuming

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidassembly time
Core Design Contradiction:
Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The patent combines the conductive sheet with the mount bracket into an integrated structure. The mount bracket itself is made of conductive material and directly contacts the interface card, eliminating the need for a separate conductive sheet. This merging of functions reduces assembly steps and time while maintaining EMI shielding effectiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mount bracket is designed to serve multiple functions simultaneously: mechanical support for the interface card, electrical grounding through its conductive material, and EMI shielding. This multi-functionality eliminates the need for separate components and simplifies the overall assembly process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Object-affected harmful factors

If a conductive sheet is used to ground the interface card, then electromagnetic interference is reduced, but the device structure becomes more complex

Engineering Contradiction:
Improveelectromagnetic interferenceVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The conductive sheet is merged with the mount bracket into a single integrated component. The mount bracket is constructed from conductive material that directly contacts the interface card, combining the grounding and structural functions into one element. This reduces the total number of parts and simplifies the overall device structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The mount bracket is designed as a multi-functional component that provides mechanical support, electrical grounding, and EMI shielding simultaneously. This eliminates the need for separate conductive sheets and other auxiliary components, thereby reducing structural complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If multiple main portions need to be paired with mount brackets, then proper grounding is achieved, but assembly error rates increase

Engineering Contradiction:
Improvegrounding reliabilityVSAvoidassembly accuracy
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The framework is segmented into multiple main portions, each designed to correspond to a specific mount bracket position. Each main portion has a unique geometry that matches its designated mount bracket, ensuring proper pairing without confusion. This segmentation with differentiated features improves assembly accuracy while maintaining reliable grounding.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The main portions are designed with asymmetric features that correspond to the specific mount brackets they are intended to pair with. This asymmetry prevents incorrect pairing and ensures that each main portion is installed in the correct position, thereby improving assembly accuracy and grounding reliability.

Inventive Principle:
Principle #4Asymmetry

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively grounds interface cards, reducing electromagnetic interference and simplifying assembly by allowing for one-step installation and eliminating the need for pairing main portions with mount brackets, thus saving time and reducing error rates.

Implementation Method 1

electronic components in the computer may generate electromagnetic interference (EMI) which may generate an adverse effect on the interface card

Methodology Applied
Scientific EffectElectromagnetic interference: Electromagnetic Induction

Implementation Method 2

the interface card can be electrically connected to the mount bracket via the sheet, and the interface card can be grounded by the sheet

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS10345872B1Computer case
Publication Date: 2019.07.09 VITESCO TECHNOLOGIES USA LLC
  • US10345872B1 patent drawing
  • US10345872B1 patent drawing
  • US10345872B1 patent drawing

AI summary

This disclosure relates to a computer case configured to fix an interface card. The computer case includes a main body, a plurality of mount brackets and a framework. The main body includes a first hole and a plurality of second holes. The plurality of second holes are located at a side of the first hole. The plurality of mount brackets are located at the first hole. The framework is conductive. The framework includes a plurality of protrusion portions and a plurality of main portions. The plurality of protrusion portions are connected to the plurality of main portions and are respectively inserted in the plurality of second holes. The framework is disposed on the main body via the plurality of protrusion portions. The plurality of main portions are respectively in contact with the plurality of mount brackets.